公开(公告)号：US11737242B2

公开(公告)日：2023-08-22

申请号：US17949801

申请日：2022-09-21

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lei Cao ,  Shoubiao Xu ,  Shanjiu Chi

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20418 ,  G06F1/20 ,  H05K7/20709

Abstract: A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

公开(公告)号：US20240389264A1

公开(公告)日：2024-11-21

申请号：US18564897

申请日：2022-05-26

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jianliang Wang ,  Along Zhou ,  Huipeng Wu ,  Jian Shi ,  Shoubiao Xu

IPC: H05K7/20

Abstract: A heat dissipation system includes a first heat dissipation panel, a second heat dissipation panel, a first rotating shaft assembly, a second rotating shaft assembly, and a driving apparatus. The first heat dissipation panel is provided with a first liquid channel, and the first liquid channel includes a first interface and a second interface. The second heat dissipation panel is provided with a second liquid channel, and the second liquid channel includes a third interface and a fourth interface. The first interface is in communication with the third interface through the first rotating shaft assembly, and the second interface is in communication with the fourth interface through the second rotating shaft assembly. The driving apparatus is configured to drive a liquid medium to flow between the first heat dissipation panel and the second heat dissipation panel.

公开(公告)号：US11490545B2

公开(公告)日：2022-11-01

申请号：US17089089

申请日：2020-11-04

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lei Cao ,  Shoubiao Xu ,  Shanjiu Chi

IPC: H05K7/20 ,  G06F1/20

Abstract: A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

公开(公告)号：US11502019B2

公开(公告)日：2022-11-15

申请号：US17320533

申请日：2021-05-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Shoubiao Xu ,  Shanjiu Chi ,  Wenhui Zeng

IPC: H01L23/00 ,  H01L23/40 ,  H01L23/467 ,  H01L23/427 ,  H05K7/20 ,  F28F3/06

Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

公开(公告)号：US20210051818A1

公开(公告)日：2021-02-18

申请号：US17089089

申请日：2020-11-04

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lei Cao ,  Shoubiao Xu ,  Shanjiu Chi

IPC: H05K7/20 ,  G06F1/20

Abstract: A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

公开(公告)号：US20240164053A1

公开(公告)日：2024-05-16

申请号：US18422847

申请日：2024-01-25

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jianliang Wang ,  Dzmitry Kushner ,  Jiyang Li ,  Shuqin Xie ,  Along Zhou ,  Jian Shi ,  Shoubiao Xu

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20254 ,  G06F1/203 ,  H05K7/20263

Abstract: A liquid cooling plate includes a housing, a support structure, and a coolant. The housing includes a top wall and a bottom wall, the top wall and the bottom wall are covered to form an accommodation cavity, and the accommodation cavity includes a first region and a second region. The support structure is disposed in the first region and is located between the top wall and the bottom wall. The coolant flows in the accommodation cavity to dissipate heat from a heat generating device, the coolant can expand in volume when being heated and shrink in volume when being cooled, and the second region can deform to absorb a volume variation of the coolant.

公开(公告)号：US20230032386A1

公开(公告)日：2023-02-02

申请号：US17949801

申请日：2022-09-21

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lei Cao ,  Shoubiao Xu ,  Shanjiu Chi

IPC: H05K7/20 ,  G06F1/20

Abstract: A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

公开(公告)号：US11043442B2

公开(公告)日：2021-06-22

申请号：US16298443

申请日：2019-03-11

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Shoubiao Xu ,  Shanjiu Chi ,  Wenhui Zeng

IPC: H01L23/00 ,  H01L23/40 ,  H01L23/467 ,  H01L23/427 ,  H05K7/20 ,  F28F3/06

Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.