公开(公告)号：US20240121901A1

公开(公告)日：2024-04-11

申请号：US18477392

申请日：2023-09-28

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Chunyan Zhao ,  Chao Shen ,  Kuanming Bao

IPC: H05K1/18 ,  H01L23/373 ,  H01L23/538

CPC classification number: H05K1/186 ,  H01L23/3736 ,  H01L23/5383 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003

Abstract: This application provides an embedded package structure, a power supply apparatus, and an electronic device. First electronic components with smaller sizes are stacked, and then arranged in a substrate frame in a two-dimensional manner with a larger-size inductor component to form an embedded package structure. Then, a chip is disposed on the embedded package structure, so that the chip serving as a main heat source is placed on a surface of the power supply apparatus.

公开(公告)号：US12075558B2

公开(公告)日：2024-08-27

申请号：US17559763

申请日：2021-12-22

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Zhaozheng Hou ,  Xiaojing Liao ,  Chao Shen ,  Dongxing Wang

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/182 ,  H05K1/185 ,  H05K7/20218

Abstract: The present disclosure relates to the field of printed circuit board technologies. A printed circuit board with good heat dissipation performance is provided and includes a substrate serving as a board body of the printed circuit board, a heating component embedded in the substrate, and a cooling liquid channel disposed in the substrate. The cooling liquid channel is disposed in the printed circuit board, and passes around the heating component to exchange heat with the heating component, so that a heat dissipation path is shortened and heat dissipation efficiency is improved, thereby quickening heat dissipation of the printed circuit board, and prolonging a service life of the printed circuit board.