公开(公告)号：US12046912B2

公开(公告)日：2024-07-23

申请号：US17947688

申请日：2022-09-19

Applicant: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.

Inventor： Hao Wu ,  Quanming Li ,  Jun Chen ,  Li He

IPC: H02J50/00 ,  H02J50/10 ,  H05K7/20

CPC classification number: H02J50/005 ,  H02J50/10 ,  H05K7/20145

Abstract: Embodiments of this application provide a wireless charger, and relate to the field of charging device technologies. The wireless charger includes a wireless charging module, a first fan, a housing including a contact plate used for contact with the rear surface of the terminal device, and an air intake vent disposed at a position that is of the housing and that is close to the first fan, and an airflow guide structure disposed on a side that is of the housing and that is adjacent to the contact plate. The airflow guide structure extends toward the display surface of the terminal device.

公开(公告)号：US11800677B2

公开(公告)日：2023-10-24

申请号：US17665225

申请日：2022-02-04

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Hao Wu ,  Jun Chen ,  Chunxia Xu ,  Xiaowei Hui

IPC: H01R13/66 ,  H05K7/20 ,  H01R24/68

CPC classification number: H05K7/20145 ,  H01R13/665 ,  H01R24/68 ,  H05K7/20909

Abstract: A power adapter includes a housing, a circuit board component, and a heat dissipation air duct. The housing has an air inlet and an air outlet, the circuit board component is located inside the housing, the heat dissipation air duct is located in the housing and/or a spacing area between the housing and the circuit board component, the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and the heat dissipation air duct is configured to dissipate heat from the housing and/or the circuit board component.

公开(公告)号：US20240098879A1

公开(公告)日：2024-03-21

申请号：US18525081

申请日：2023-11-30

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Chunxia Xu ,  Xiaowei Hui ,  Hao Wu

IPC: H05K1/02 ,  B60L53/14 ,  H02J7/00 ,  H02J50/12 ,  H05K7/20

CPC classification number: H05K1/0209 ,  B60L53/14 ,  H02J7/0042 ,  H02J50/12 ,  H05K7/20218 ,  H05K2201/062

Abstract: This disclosure discloses a power adapter and an electronic device system, and relates to the field of heat dissipation technologies. The power adapter includes a housing, a printed circuit board assembly, and insulation powder filled in the housing. The printed circuit board assembly is fastened in the housing, and the insulation powder is used to conduct heat generated by the printed circuit board assembly to the housing. Compared with a thermally conductive adhesive, the insulation powder does not have a problem of poor fluidity, and can more easily be sufficiently filled. This solution improves heat dissipation effect of the power adapter and helps further increase a charging power of the power adapter.

公开(公告)号：US20230040642A1

公开(公告)日：2023-02-09

申请号：US17966980

申请日：2022-10-17

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Hao Wu ,  Jun Chen ,  Quanming Li

IPC: B60K11/04

Abstract: A powertrain is provided, including: a motor control unit (1) including a housing (11) and a first functional unit (12) disposed in the housing (11) and capable of generating heat during operation; and a heat exchanger (2) disposed in the housing (11), where the heat exchanger (2) includes a first circulation channel (21) for a first cooling medium to circulate and a second circulation channel (22) for a second cooling medium to circulate. The first circulation channel (21) has a first external cooling surface (P1), and the first circulation channel (21) conducts heat with the first functional unit (12) at the first external cooling surface (P1); and/or the first circulation channel (21) has a second external cooling surface (P2), and the first circulation channel (21) conducts heat with an inner surface of the housing (11) at the second external cooling surface (P2).

公开(公告)号：US12114461B2

公开(公告)日：2024-10-08

申请号：US17711843

申请日：2022-04-01

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Chunxia Xu ,  Jun Chen ,  Xiaowei Hui ,  Hao Wu

IPC: H05K7/20 ,  H01R13/66 ,  H01R24/68

CPC classification number: H05K7/20145 ,  H01R13/665 ,  H01R24/68 ,  H05K7/20909

Abstract: A power adapter and a manufacturing method thereof are provided. The power adapter includes a housing, a circuit board assembly, and a first heat dissipation part. There is accommodation space inside the housing, a line interface is disposed at a first end of the housing, and a power connector is disposed at a second end of the housing. The circuit board assembly is disposed in the accommodation space, and the circuit board assembly is electrically connected to the line interface and the power connector. The first heat dissipation part coats the outside of the circuit board assembly, and there is a gap between an outer wall of the first heat dissipation part and an inner wall of the housing.

公开(公告)号：US11991854B2

公开(公告)日：2024-05-21

申请号：US17704996

申请日：2022-03-25

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Hao Wu ,  Jun Chen ,  Yongwang Xiao ,  Jun Li

IPC: H05K7/20 ,  H02J7/00 ,  H02J50/00 ,  G06F1/16

CPC classification number: H05K7/20145 ,  H02J7/0044 ,  H02J50/00 ,  H05K7/20172 ,  G06F1/1632

Abstract: A wireless charging base is provided, and is mainly applied to electronic devices such as a mobile phone and a tablet computer. The wireless charging base includes a charging panel, configured to charge the electronic device. The charging panel includes a first air vent and a second air vent. A first base plate is disposed on an upper surface of the charging panel, is located at an end of the charging panel, and is configured to support the electronic device when the electronic device is being charged. The first base plate includes a third air vent. A second base plate is disposed on the lower surface of the charging panel, is located at the same end as the first base plate, and is configured to support the charging panel. The second base plate includes a fourth air vent.