公开(公告)号：US20190146632A1

公开(公告)日：2019-05-16

申请号：US16304459

申请日：2017-05-23

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jie ZOU ,  Lianming ZHANG ,  Wenfeng WANG

IPC: G06F3/041 ,  H02J7/04

Abstract: A power adapter control method is provided. The method includes: obtaining a scanning frequency of the TP and a strength of common mode noise generated by a power adapter at the scanning frequency of the TP; determining whether the strength of the common mode noise is greater than or equal to a preset threshold; and when the strength of the common mode noise is greater than or equal to the preset threshold, adjusting a working frequency of a control IC of the power adapter, so that a strength of common mode noise newly generated by the power adapter at the scanning frequency of the TP is less than the preset threshold. The embodiments of the present invention are used for a process of reducing interference of the common mode noise to the TP.

公开(公告)号：US20180366266A1

公开(公告)日：2018-12-20

申请号：US16062694

申请日：2015-12-16

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Cheng HE ,  Xiaosong LIU ,  Zhiguo ZHANG ,  Jie ZOU

IPC: H01F27/36 ,  H05K9/00 ,  H05K1/18

Abstract: A magnetically shielded power inductor and a method for producing a magnetically shielded power inductor are described. The magnetically shielded power inductor includes a power inductor component and a wave-absorbing material layer. The wave-absorbing material layer is laminated on a surface of the power inductor component. The wave-absorbing material layer is configured to mitigate magnetic field interference to the power inductor component from a surrounding magnet of the wave-absorbing material layer.

公开(公告)号：US20170220082A1

公开(公告)日：2017-08-03

申请号：US15508890

申请日：2014-06-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang JIN ,  Nanbo KANG ,  Jie ZOU ,  Xiaowei HUI

IPC: G06F1/20 ,  F28D15/04 ,  F28D15/02

CPC classification number: G06F1/203 ,  F28D15/0241 ,  F28D15/0275 ,  F28D15/04 ,  H01L23/34 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20 ,  H01L2924/00

Abstract: An intelligent terminal heat dissipation apparatus and an intelligent terminal are disclosed. The intelligent terminal heat dissipation apparatus includes at least one flexible heat pipe, where two ends of the flexible heat pipe are condensation ends, the middle of the flexible heat pipe is an evaporation end, the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts, the one or more heat pipe rigid parts and the one or more heat pipe flexible parts of the condensation end are arranged alternately, the evaporation end includes at least one heat pipe rigid part, and an intelligent terminal body is mounted on the evaporation end. By using the intelligent terminal heat dissipation apparatus, flexible heat dissipation is implemented for a bendable device.