公开(公告)号：US20150022968A1

公开(公告)日：2015-01-22

申请号：US14487517

申请日：2014-09-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： Mingliang Hao ,  Yuan Dong ,  Mingxin Feng

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  H05K7/20136 ,  H05K7/20145 ,  H05K7/20563

Abstract: A plugboard heat dissipation system is provided. The system may include a plugboard, an enclosure, and an air supply apparatus that provides an air source for heat dissipation, a length of a first board edge on the plugboard is greater than a length of a second board edge, an output port is disposed on the first board edge, a spatial position of the second board edge is corresponding to that of the first board edge, a connecting part connected to another plugboard orthogonal to the plugboard is disposed, the output port is output out of an enclosure using a first end face of the enclosure, the connecting part is output out of the enclosure using a second end face of the enclosure. In the system, when space in which the plugboard is located is limited, the number of ports on the plugboard can be expanded.

Abstract translation: 提供插板散热系统。 该系统可以包括插板，外壳和提供用于散热的空气源的空气供应装置，插板上的第一板边缘的长度大于第二板边缘的长度，输出端口被布置 在第一板边缘上，第二板边缘的空间位置对应于第一板边缘的空间位置，连接到与插板正交的另一插板的连接部分，输出端口使用第一板边缘从外壳输出 外壳的端面，连接部分使用外壳的第二端面从外壳输出。 在系统中，当插板的位置受限时，插板上的端口数量可以扩展。

公开(公告)号：US09423839B2

公开(公告)日：2016-08-23

申请号：US14487517

申请日：2014-09-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： Mingliang Hao ,  Yuan Dong ,  Mingxin Feng

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  H05K7/20136 ,  H05K7/20145 ,  H05K7/20563

Abstract: A plugboard heat dissipation system is provided. The system may include a plugboard, an enclosure, and an air supply apparatus that provides an air source for heat dissipation, a length of a first board edge on the plugboard is greater than a length of a second board edge, an output port is disposed on the first board edge, a spatial position of the second board edge is corresponding to that of the first board edge, a connecting part connected to another plugboard orthogonal to the plugboard is disposed, the output port is output out of an enclosure using a first end face of the enclosure, the connecting part is output out of the enclosure using a second end face of the enclosure. In the system, when space in which the plugboard is located is limited, the number of ports on the plugboard can be expanded.

Abstract translation: 提供插板散热系统。 该系统可以包括插板，外壳和提供用于散热的空气源的空气供应装置，插板上的第一板边缘的长度大于第二板边缘的长度，输出端口被布置 在第一板边缘上，第二板边缘的空间位置对应于第一板边缘的空间位置，连接到与插板正交的另一插板的连接部分，输出端口使用第一板边缘从外壳输出 外壳的端面，连接部分使用外壳的第二端面从外壳输出。 在系统中，当插板的位置受限时，插板上的端口数量可以扩展。

公开(公告)号：US20140071621A1

公开(公告)日：2014-03-13

申请号：US14077498

申请日：2013-11-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yuan Dong ,  Liqian Zhai ,  Shanjiu Chi ,  Jun Zhao

IPC: H05K7/20

CPC classification number: H05K7/20581 ,  H05K7/20727 ,  H05K7/20736

Abstract: Embodiments of the present invention disclose an electronic equipment cooling system including: a cabinet; at least one electronic equipment chassis that is installed inside the cabinet; and an auxiliary cooling device including an air pressurizing device, an air supply plenum box, and an air-guiding device. The air supply plenum box is disposed on an inner side of the cabinet. The air pressurizing device is disposed at the top or bottom of the cabinet, and an air exhaust on a sidewall of the air pressurizing device is connected to a corresponding air intake on a sidewall of the air supply plenum box. The air-guiding device is installed inside the electronic equipment chassis, an air intake of the air-guiding device is connected to an air exhaust of the air supply plenum device, and an air exhaust of the air-guiding device faces a component inside the electronic equipment chassis.

Abstract translation: 本发明的实施例公开了一种电子设备冷却系统，包括：机柜; 安装在机柜内的至少一个电子设备底盘; 以及辅助冷却装置，其包括空气加压装置，空气供给箱和空气引导装置。 供气室被设置在机柜的内侧。 空气加压装置设置在机柜的顶部或底部，空气加压装置的侧壁上的排气口与供气室的侧壁上的相应进气口连接。 空气引导装置安装在电子设备底盘的内部，空气引导装置的进气口连接到供气通风装置的排气口，空气引导装置的排气面向内部的部件 电子设备底盘。

公开(公告)号：US09357679B2

公开(公告)日：2016-05-31

申请号：US14077498

申请日：2013-11-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yuan Dong ,  Liqian Zhai ,  Shanjiu Chi ,  Jun Zhao

IPC: H05K7/20

CPC classification number: H05K7/20581 ,  H05K7/20727 ,  H05K7/20736

Abstract: Embodiments of the present invention disclose an electronic equipment cooling system including: a cabinet; at least one electronic equipment chassis that is installed inside the cabinet; and an auxiliary cooling device including an air pressurizing device, an air supply plenum box, and an air-guiding device. The air supply plenum box is disposed on an inner side of the cabinet. The air pressurizing device is disposed at the top or bottom of the cabinet, and an air exhaust on a sidewall of the air pressurizing device is connected to a corresponding air intake on a sidewall of the air supply plenum box. The air-guiding device is installed inside the electronic equipment chassis, an air intake of the air-guiding device is connected to an air exhaust of the air supply plenum device, and an air exhaust of the air-guiding device faces a component inside the electronic equipment chassis.

Abstract translation: 本发明的实施例公开了一种电子设备冷却系统，包括：柜体; 安装在机柜内的至少一个电子设备底盘; 以及辅助冷却装置，其包括空气加压装置，空气供给箱和空气引导装置。 供气室被设置在机柜的内侧。 空气加压装置设置在机柜的顶部或底部，空气加压装置的侧壁上的排气口与供气室的侧壁上的相应进气口连接。 空气引导装置安装在电子设备底盘的内部，空气引导装置的进气口连接到供气通风装置的排气口，空气引导装置的排气面向内部的部件 电子设备底盘。

公开(公告)号：US20140342652A1

公开(公告)日：2014-11-20

申请号：US14451549

申请日：2014-08-05

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yuan Dong ,  Mingxin Feng ,  Mingliang Hao

IPC: H05K7/20 ,  F24F7/007

CPC classification number: H05K7/20136 ,  F24F7/007 ,  H05K7/20145 ,  H05K7/20727

Abstract: An air cooling system is provided. The air cooling system includes multiple air moving units and an air deflecting apparatus. The multiple air moving units are disposed upstream of air flowing through a heating component. The air deflecting apparatus is disposed between an air outlet of the multiple air moving units and the heating component. The air deflecting apparatus is configured to perform layering and deflecting for outgoing air of the multiple air moving units and divide the air into at least two layers. Air at each layer is supplied jointly by the multiple air moving units, and air directions of air in at least two adjacent layer spaces are different. According to the present disclosure, a heat dissipation impact resulting from a failure of a single air moving unit in the multiple air moving units can be effectively avoided.

Abstract translation: 提供空气冷却系统。 空气冷却系统包括多个空气移动单元和空气偏转装置。 多个空气移动单元设置在流过加热部件的空气的上游。 空气偏转装置设置在多个空气移动单元的空气出口和加热部件之间。 空气偏转装置被构造成对多个空气移动单元的输出空气进行分层和偏转，并将空气分成至少两层。 各层的空气由多个空气移动单元联合供给，并且至少两个相邻的层间空间中的空气的空气方向不同。 根据本公开，可以有效地避免由多个空气移动单元中的单个空气移动单元的故障引起的散热冲击。

公开(公告)号：US20140138069A1

公开(公告)日：2014-05-22

申请号：US14103504

申请日：2013-12-11

Applicant: Huawei Technologies Co., Ltd.

Inventor： Mingliang Hao ,  Yuan Dong ,  Lei Bai

IPC: H05K7/20

CPC classification number: H05K7/20554 ,  G06F1/20 ,  H05K7/20 ,  H05K7/20563 ,  H05K7/20572 ,  H05K7/20736

Abstract: The present invention relates to a heat dissipation system. The heat dissipation system includes: a chassis, configured to house single boards of an orthogonal architecture, where the single boards includes a vertically inserted board; a first fan group, installed inside a first air intake pipe in the upper front of the chassis and configured to guide air into the chassis; and an air guide cavity, installed inside the chassis and configured to transfer the air that is guided by the first fan group into the chassis to a component on the vertically inserted board to perform heat dissipation. With the heat dissipation system in embodiments of the present invention, air is separately supplied to a heat dissipation component on a vertically inserted board in a communications system device based on an orthogonal architecture.

Abstract translation: 散热系统技术领域本发明涉及散热系统。 所述散热系统包括：底盘，被配置为容纳正交结构的单板，其中所述单板包括垂直插入的板; 第一风扇组，安装在所述底盘的上前部的第一进气管内并构造成将空气引导到所述底盘中; 以及空气引导腔，其安装在所述底盘内并且构造成将由所述第一风扇组引导的空气输送到所述底盘中的所述垂直插入板上的部件以进行散热。 利用本发明的实施例中的散热系统，基于正交架构，将空气分别提供给通信系统设备中的垂直插入板上的散热部件。

公开(公告)号：US09215831B2

公开(公告)日：2015-12-15

申请号：US14103504

申请日：2013-12-11

Applicant: Huawei Technologies Co., Ltd.

Inventor： Mingliang Hao ,  Yuan Dong ,  Lei Bai

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20554 ,  G06F1/20 ,  H05K7/20 ,  H05K7/20563 ,  H05K7/20572 ,  H05K7/20736

Abstract: The present invention relates to a heat dissipation system. The heat dissipation system includes: a chassis, configured to house single boards of an orthogonal architecture, where the single boards includes a vertically inserted board; a first fan group, installed inside a first air intake pipe in the upper front of the chassis and configured to guide air into the chassis; and an air guide cavity, installed inside the chassis and configured to transfer the air that is guided by the first fan group into the chassis to a component on the vertically inserted board to perform heat dissipation. With the heat dissipation system in embodiments of the present invention, air is separately supplied to a heat dissipation component on a vertically inserted board in a communications system device based on an orthogonal architecture.

Abstract translation: 散热系统技术领域本发明涉及散热系统。 所述散热系统包括：底盘，被配置为容纳正交结构的单板，其中所述单板包括垂直插入的板; 第一风扇组，安装在所述底盘的上前部的第一进气管内并构造成将空气引导到所述底盘中; 以及空气引导腔，其安装在所述底盘内并且构造成将由所述第一风扇组引导的空气输送到所述底盘中的所述垂直插入板上的部件以进行散热。 利用本发明的实施例中的散热系统，基于正交架构，将空气分别提供给通信系统设备中的垂直插入板上的散热部件。