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公开(公告)号：US09660414B2
公开(公告)日：2017-05-23
申请号：US14948558
申请日：2015-11-23
Applicant: Huawei Technologies Co., Ltd.
Inventor： Shuliang Huang , Mingliang Hao , Zaomeng Liu
CPC classification number: H01S5/02469 , H01L41/081 , H01L41/09 , H01S5/022 , H01S5/02208 , H01S5/02248 , H01S5/02407 , H05K1/0209 , H05K2201/10121
Abstract: A heat dissipation system for an optical module, related to communication fittings technologies, is provided to improve heat dissipation efficiency of the optical module. The heat dissipation system for an optical module includes a circuit card on which at least one optical module is mounted, where the optical module includes a housing and a laser disposed inside the housing. A first heat dissipation apparatus is fixedly disposed on the circuit card. A heat dissipation window is provided in an area that is above the laser and on the housing of the optical module. The first heat dissipation apparatus performs heat dissipation on the heat dissipation window.
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公开(公告)号：US09351426B2
公开(公告)日：2016-05-24
申请号：US14077455
申请日：2013-11-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Weiqiang Tian , Jianxing Liao , Ruifeng Shui , Mingliang Hao
CPC classification number: H05K7/20754 , G06F1/20 , H05K7/20727
Abstract: Embodiments of the present invention relate to a heat dissipating device including a chassis, a backplane, at least one rear board, and at least one fan, where the chassis includes horizontal wall panels, vertical wall panels, and a rear wall panel; the chassis includes one or more partition plates; the rear board includes one or more second hole areas; and the one or more partition plates, the horizontal wall panels, the vertical wall panels, the rear wall panel, the backplane, and the rear board form a cooling air duct that does not pass a front board, so that under an effect of the fan, a cooling air flow is discharged out of the chassis after passing the rear board, the second hole area, and the fan, so as to implement heat dissipation for a functional module on the rear board.
Abstract translation: 本发明的实施例涉及一种散热装置，其包括底盘，背板，至少一个后板和至少一个风扇，其中所述底盘包括水平壁板，垂直壁板和后壁板; 底盘包括一个或多个隔板; 后板包括一个或多个第二孔区域; 并且一个或多个分隔板，水平壁板，垂直壁板，后壁板，背板和后板形成不通过前板的冷却风道，从而在 风扇，通过后板，第二孔区域和风扇之后，冷却空气流从底盘排出，以便对后板上的功能模块进行散热。
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公开(公告)号：US20160057888A1
公开(公告)日：2016-02-25
申请号：US14828321
申请日：2015-08-17
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yuping Hong , Chenglong Wang , Mingliang Hao , Youhe Ke
CPC classification number: H05K7/20145 , H04B1/036 , H05K7/20572
Abstract: A communications product, including at least one RRU and a fan assembly, where the fan assembly is independent of the at least one RRU, and is disposed side by side with the at least one RRU, an air duct is disposed between the fan assembly and the RRU, and an airflow passes, from the fan assembly, through the air duct, and arrives at the at least one RRU, to dissipate heat of the at least one RRU. The communications product of the present disclosure can ensure a heat-dissipation capability, and also can allow the RRU to be small in size. The present disclosure further provides a base station system that includes the communications product.
Abstract translation: 一种通信产品，包括至少一个RRU和风扇组件，其中所述风扇组件独立于所述至少一个RRU，并且与所述至少一个RRU并排设置，风道布置在所述风扇组件和 RRU，并且气流从风扇组件通过空气管道，并到达至少一个RRU，以消散至少一个RRU的热量。 本公开的通信产品可以确保散热能力，并且还可以允许RRU的尺寸小。 本公开还提供了一种包括通信产品的基站系统。
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公开(公告)号：US20140342652A1
公开(公告)日：2014-11-20
申请号：US14451549
申请日：2014-08-05
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yuan Dong , Mingxin Feng , Mingliang Hao
CPC classification number: H05K7/20136 , F24F7/007 , H05K7/20145 , H05K7/20727
Abstract: An air cooling system is provided. The air cooling system includes multiple air moving units and an air deflecting apparatus. The multiple air moving units are disposed upstream of air flowing through a heating component. The air deflecting apparatus is disposed between an air outlet of the multiple air moving units and the heating component. The air deflecting apparatus is configured to perform layering and deflecting for outgoing air of the multiple air moving units and divide the air into at least two layers. Air at each layer is supplied jointly by the multiple air moving units, and air directions of air in at least two adjacent layer spaces are different. According to the present disclosure, a heat dissipation impact resulting from a failure of a single air moving unit in the multiple air moving units can be effectively avoided.
Abstract translation: 提供空气冷却系统。 空气冷却系统包括多个空气移动单元和空气偏转装置。 多个空气移动单元设置在流过加热部件的空气的上游。 空气偏转装置设置在多个空气移动单元的空气出口和加热部件之间。 空气偏转装置被构造成对多个空气移动单元的输出空气进行分层和偏转，并将空气分成至少两层。 各层的空气由多个空气移动单元联合供给，并且至少两个相邻的层间空间中的空气的空气方向不同。 根据本公开，可以有效地避免由多个空气移动单元中的单个空气移动单元的故障引起的散热冲击。
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公开(公告)号：US20140138069A1
公开(公告)日：2014-05-22
申请号：US14103504
申请日：2013-12-11
Applicant: Huawei Technologies Co., Ltd.
Inventor： Mingliang Hao , Yuan Dong , Lei Bai
IPC: H05K7/20
CPC classification number: H05K7/20554 , G06F1/20 , H05K7/20 , H05K7/20563 , H05K7/20572 , H05K7/20736
Abstract: The present invention relates to a heat dissipation system. The heat dissipation system includes: a chassis, configured to house single boards of an orthogonal architecture, where the single boards includes a vertically inserted board; a first fan group, installed inside a first air intake pipe in the upper front of the chassis and configured to guide air into the chassis; and an air guide cavity, installed inside the chassis and configured to transfer the air that is guided by the first fan group into the chassis to a component on the vertically inserted board to perform heat dissipation. With the heat dissipation system in embodiments of the present invention, air is separately supplied to a heat dissipation component on a vertically inserted board in a communications system device based on an orthogonal architecture.
Abstract translation: 散热系统技术领域本发明涉及散热系统。 所述散热系统包括：底盘，被配置为容纳正交结构的单板，其中所述单板包括垂直插入的板; 第一风扇组，安装在所述底盘的上前部的第一进气管内并构造成将空气引导到所述底盘中; 以及空气引导腔，其安装在所述底盘内并且构造成将由所述第一风扇组引导的空气输送到所述底盘中的所述垂直插入板上的部件以进行散热。 利用本发明的实施例中的散热系统，基于正交架构，将空气分别提供给通信系统设备中的垂直插入板上的散热部件。
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Patent Agency Ranking
公开(公告)号：US09872416B2
公开(公告)日：2018-01-16
申请号：US15435711
申请日：2017-02-17
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Youhe Ke , Yuping Hong , Mingliang Hao
IPC: H05K7/20 , H04W88/08 , H04Q1/02 , H04B10/2575
CPC classification number: H05K7/20145 , H04B10/25752 , H04Q1/035 , H04W88/085
Abstract: The present invention discloses a communications product (100), including a remote radio module (10) and a mounting kit (30), where the mounting kit (30) includes a fastening part (32), the fastening part (32) is configured to mount and fasten the remote radio module (10) to a holder, the mounting kit (30) further includes a ventilation part (34) and an air supply part (36), an air source is disposed inside the air supply part (36), the ventilation part (34) is connected between the fastening part (32) and the air supply part (36), a ventilation channel is disposed inside the ventilation part (34), and the ventilation channel allows the air supply part (36) to communicate with the remote radio module (10), so that an air flow generated by the air source reaches the remote radio module (10) after passing through the ventilation channel, to dissipate heat for the remote radio module.
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公开(公告)号：US20150022968A1
公开(公告)日：2015-01-22
申请号：US14487517
申请日：2014-09-16
Applicant: Huawei Technologies Co., Ltd.
Inventor： Mingliang Hao , Yuan Dong , Mingxin Feng
CPC classification number: G06F1/20 , H05K7/20136 , H05K7/20145 , H05K7/20563
Abstract: A plugboard heat dissipation system is provided. The system may include a plugboard, an enclosure, and an air supply apparatus that provides an air source for heat dissipation, a length of a first board edge on the plugboard is greater than a length of a second board edge, an output port is disposed on the first board edge, a spatial position of the second board edge is corresponding to that of the first board edge, a connecting part connected to another plugboard orthogonal to the plugboard is disposed, the output port is output out of an enclosure using a first end face of the enclosure, the connecting part is output out of the enclosure using a second end face of the enclosure. In the system, when space in which the plugboard is located is limited, the number of ports on the plugboard can be expanded.
Abstract translation: 提供插板散热系统。 该系统可以包括插板，外壳和提供用于散热的空气源的空气供应装置，插板上的第一板边缘的长度大于第二板边缘的长度，输出端口被布置 在第一板边缘上，第二板边缘的空间位置对应于第一板边缘的空间位置，连接到与插板正交的另一插板的连接部分，输出端口使用第一板边缘从外壳输出 外壳的端面，连接部分使用外壳的第二端面从外壳输出。 在系统中，当插板的位置受限时，插板上的端口数量可以扩展。
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公开(公告)号：US20140071618A1
公开(公告)日：2014-03-13
申请号：US14077455
申请日：2013-11-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Weiqiang Tian , Jianxing Liao , Ruifeng Shui , Mingliang Hao
IPC: H05K7/20
CPC classification number: H05K7/20754 , G06F1/20 , H05K7/20727
Abstract: Embodiments of the present invention relate to a heat dissipating device including a chassis, a backplane, at least one rear board, and at least one fan, where the chassis includes horizontal wall panels, vertical wall panels, and a rear wall panel; the chassis includes one or more partition plates; the rear board includes one or more second hole areas; and the one or more partition plates, the horizontal wall panels, the vertical wall panels, the rear wall panel, the backplane, and the rear board form a cooling air duct that does not pass a front board, so that under an effect of the fan, a cooling air flow is discharged out of the chassis after passing the rear board, the second hole area, and the fan, so as to implement heat dissipation for a functional module on the rear board.
Abstract translation: 本发明的实施例涉及一种散热装置，其包括底盘，背板，至少一个后板和至少一个风扇，其中所述底盘包括水平壁板，垂直壁板和后壁板; 底盘包括一个或多个隔板; 后板包括一个或多个第二孔区域; 并且一个或多个分隔板，水平壁板，垂直壁板，后壁板，背板和后板形成不通过前板的冷却风道，从而在 风扇，通过后板，第二孔区域和风扇之后，冷却空气流从底盘排出，以便对后板上的功能模块进行散热。
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公开(公告)号：US09451725B2
公开(公告)日：2016-09-20
申请号：US14828321
申请日：2015-08-17
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yuping Hong , Chenglong Wang , Mingliang Hao , Youhe Ke
CPC classification number: H05K7/20145 , H04B1/036 , H05K7/20572
Abstract: A communications product, including at least one RRU and a fan assembly, where the fan assembly is independent of the at least one RRU, and is disposed side by side with the at least one RRU, an air duct is disposed between the fan assembly and the RRU, and an airflow passes, from the fan assembly, through the air duct, and arrives at the at least one RRU, to dissipate heat of the at least one RRU. The communications product of the present disclosure can ensure a heat-dissipation capability, and also can allow the RRU to be small in size. The present disclosure further provides a base station system that includes the communications product.
Abstract translation: 一种通信产品，包括至少一个RRU和风扇组件，其中所述风扇组件独立于所述至少一个RRU，并且与所述至少一个RRU并排设置，风道布置在所述风扇组件和 RRU，并且气流从风扇组件通过空气管道，并到达至少一个RRU，以消散至少一个RRU的热量。 本公开的通信产品可以确保散热能力，并且还可以允许RRU的尺寸小。 本公开还提供了一种包括通信产品的基站系统。
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公开(公告)号：US09215831B2
公开(公告)日：2015-12-15
申请号：US14103504
申请日：2013-12-11
Applicant: Huawei Technologies Co., Ltd.
Inventor： Mingliang Hao , Yuan Dong , Lei Bai
CPC classification number: H05K7/20554 , G06F1/20 , H05K7/20 , H05K7/20563 , H05K7/20572 , H05K7/20736
Abstract: The present invention relates to a heat dissipation system. The heat dissipation system includes: a chassis, configured to house single boards of an orthogonal architecture, where the single boards includes a vertically inserted board; a first fan group, installed inside a first air intake pipe in the upper front of the chassis and configured to guide air into the chassis; and an air guide cavity, installed inside the chassis and configured to transfer the air that is guided by the first fan group into the chassis to a component on the vertically inserted board to perform heat dissipation. With the heat dissipation system in embodiments of the present invention, air is separately supplied to a heat dissipation component on a vertically inserted board in a communications system device based on an orthogonal architecture.
Abstract translation: 散热系统技术领域本发明涉及散热系统。 所述散热系统包括：底盘，被配置为容纳正交结构的单板，其中所述单板包括垂直插入的板; 第一风扇组，安装在所述底盘的上前部的第一进气管内并构造成将空气引导到所述底盘中; 以及空气引导腔，其安装在所述底盘内并且构造成将由所述第一风扇组引导的空气输送到所述底盘中的所述垂直插入板上的部件以进行散热。 利用本发明的实施例中的散热系统，基于正交架构，将空气分别提供给通信系统设备中的垂直插入板上的散热部件。
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