公开(公告)号：US3890455A

公开(公告)日：1975-06-17

申请号：US26594872

申请日：1972-06-23

Applicant: IBM

Inventor： BALLAS DONALD F ,  KU SAN-MEI ,  MARINACE JOHN C

IPC: C23C18/48 ,  H01L21/288 ,  H01L7/00 ,  B05D5/12

CPC classification number: H01L21/288 ,  C23C18/48 ,  Y10S148/065

Abstract: Disclosed is a method of electrolessly plating an alloy onto a substrate. To plate an alloy consisting of two elements requires the steps of mixing two solutions, each containing one of the elements to be alloy plated, and immersing a surface to be plated in said mixed solution for a fixed period of time until a desired thickness of alloy has been plated onto the surface.

Abstract translation: 公开了将合金无电镀在基板上的方法。 为了镀覆由两种元素组成的合金，需要混合两种溶液的步骤，每种溶液含有要镀合金的元素之一，并将待镀的表面浸入所述混合溶液中一段固定的时间，直到所需的合金厚度 已被镀在表面上。