公开(公告)号：US3614550A

公开(公告)日：1971-10-19

申请号：US3614550D

申请日：1969-01-09

Applicant: IBM

Inventor： MARINACE JOHN C ,  MCGIBBON RALPH C

IPC: H01S5/30 ,  H01L15/00

CPC classification number: H01S5/30

Abstract: An improved electromagnetic wave-emitting device is provided. A high pressure is applied to the device by potting the device in a suitable encapsulant. The potted device exhibits a decreased threshold current density and an increase in its efficiency. Additionally, the device has a more durable structure and an increased shelf life.

公开(公告)号：US3418226A

公开(公告)日：1968-12-24

申请号：US45668465

申请日：1965-05-18

Applicant: IBM

Inventor： MARINACE JOHN C

IPC: H01L21/3063

CPC classification number: H01L21/30635 ,  H01L21/3063 ,  Y10S148/051

公开(公告)号：US3387230A

公开(公告)日：1968-06-04

申请号：US23415462

申请日：1962-10-30

Applicant: IBM

Inventor： MARINACE JOHN C

IPC: G02F1/015 ,  G02F1/11 ,  G02F1/17 ,  H01L31/00 ,  H01L33/00

CPC classification number: H01L31/00 ,  G02F1/015 ,  G02F1/11 ,  G02F1/178 ,  H01L33/00

公开(公告)号：US3386864A

公开(公告)日：1968-06-04

申请号：US32907963

申请日：1963-12-09

Applicant: IBM

Inventor： SILVESTRI VICTOR J ,  LYONS WINCENT J ,  MARINACE JOHN C

IPC: H01L21/00 ,  H01L21/74 ,  H01L21/76 ,  H01L23/535 ,  H01L27/00 ,  H01L27/06 ,  H01L27/10

CPC classification number: H01L27/10 ,  H01L21/00 ,  H01L21/74 ,  H01L21/76 ,  H01L23/535 ,  H01L27/00 ,  H01L27/0605 ,  H01L2924/0002 ,  Y10S148/05 ,  Y10S148/085 ,  Y10S148/142 ,  H01L2924/00

公开(公告)号：US3184350A

公开(公告)日：1965-05-18

申请号：US18420662

申请日：1962-04-02

Applicant: IBM

Inventor： MARINACE JOHN C

IPC: H01L21/20

CPC classification number: H01L21/02381 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02639 ,  Y10S148/026 ,  Y10S148/085 ,  Y10S438/945

公开(公告)号：US3000768A

公开(公告)日：1961-09-19

申请号：US81657359

申请日：1959-05-28

Applicant: IBM

Inventor： MARINACE JOHN C

IPC: C22B41/00 ,  C23C16/46 ,  C25F3/12 ,  C30B25/02 ,  H01L21/00 ,  H01L21/205 ,  H01L29/00

CPC classification number: H01L21/00 ,  C22B41/00 ,  C23C16/46 ,  C25F3/12 ,  C30B25/02 ,  C30B29/08 ,  H01L21/0243 ,  H01L21/0262 ,  H01L21/02658 ,  H01L29/00 ,  Y10S148/006 ,  Y10S148/026 ,  Y10S148/05 ,  Y10S148/056 ,  Y10S148/071 ,  Y10S148/085 ,  Y10S148/135 ,  Y10S438/925 ,  Y10S438/977 ,  Y10S438/979

Abstract: 891,572. Coating with metals. INTERNATIONAL BUSINESS MACHINES CORPORATION. May 12, 1960 [May 28, 1959], No. 16840/60. Class 82(2). [Also in Group XXXVI] A P type monocrystalline germanium wafer shaped as described in Group XXXVI is placed in a sealed chamber 17 with finely divided 0À01 ohm. cm. phosphorus doped N type germanium 18 and germanium iodide as a carrier gas. The finely divided germanium source 18 is maintained at 550‹C., the wafer at 400‹C, and the rest of the chamber at 410‹C. for 48 hours during which the germanium is transported from source 18 and deposited epitaxially at 7 on the wafer.

公开(公告)号：US3890455A

公开(公告)日：1975-06-17

申请号：US26594872

申请日：1972-06-23

Applicant: IBM

Inventor： BALLAS DONALD F ,  KU SAN-MEI ,  MARINACE JOHN C

IPC: C23C18/48 ,  H01L21/288 ,  H01L7/00 ,  B05D5/12

CPC classification number: H01L21/288 ,  C23C18/48 ,  Y10S148/065

Abstract: Disclosed is a method of electrolessly plating an alloy onto a substrate. To plate an alloy consisting of two elements requires the steps of mixing two solutions, each containing one of the elements to be alloy plated, and immersing a surface to be plated in said mixed solution for a fixed period of time until a desired thickness of alloy has been plated onto the surface.

Abstract translation: 公开了将合金无电镀在基板上的方法。 为了镀覆由两种元素组成的合金，需要混合两种溶液的步骤，每种溶液含有要镀合金的元素之一，并将待镀的表面浸入所述混合溶液中一段固定的时间，直到所需的合金厚度 已被镀在表面上。

公开(公告)号：US3458369A

公开(公告)日：1969-07-29

申请号：US3458369D

申请日：1966-12-01

Applicant: IBM

Inventor： MARINACE JOHN C

IPC: H01L21/00 ,  H01L21/306 ,  H01L33/00 ,  H01S5/30 ,  H01S5/32 ,  H01L7/32

CPC classification number: H01S5/32 ,  H01L21/00 ,  H01L21/30612 ,  H01L33/00 ,  H01S5/30 ,  Y10T29/49789 ,  Y10T29/4981

公开(公告)号：US3257626A

公开(公告)日：1966-06-21

申请号：US24838062

申请日：1962-12-31

Applicant: IBM

Inventor： MARINACE JOHN C ,  RUTZ RICHARD F

IPC: H01L21/00 ,  H01L21/304 ,  H01L27/146 ,  H01S5/22 ,  H01S5/30 ,  H01S5/40 ,  H01S5/50

CPC classification number: H01S5/50 ,  H01L21/00 ,  H01L21/3043 ,  H01L27/14643 ,  H01S5/22 ,  H01S5/30 ,  H01S5/4031 ,  Y10S148/028 ,  Y10S148/085 ,  Y10S148/115 ,  Y10S257/926

公开(公告)号：US3234440A

公开(公告)日：1966-02-08

申请号：US22164862

申请日：1962-08-14

Applicant: IBM

Inventor： MARINACE JOHN C

IPC: H01L21/00 ,  H01L21/205 ,  H01L21/82 ,  H01L27/10

CPC classification number: H01L27/10 ,  H01L21/00 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/82 ,  Y10S257/926