Abstract:
Sealing glass which may be used for sealing glass plates together at relatively low temperatures. The glass has a softening temperature of about 412*C and has a thermal coefficient of expansion (from room temperature to 300*C) of about 84 X 10 7 per *C. The glass consists substantially of the following constituents in the following proportions: Percent by weight PbO 66.0 B2O3 14.0 ZnO 10.5 SiO2 2.0 CuO 2.5 Bi2O3 1.5 Al2O3 3.
Abstract:
A glass composition particularly adapted for use with ceramic materials in electronic module applications having a thermal coefficient of expansion substantially matching the thermal coefficient of expansion of ceramic material, and a low dielectric constant less than 4.5. The composition is a borosilicate glass consisting essentially of SiO2, B2O3, CaO, A12O3, Na2O, K2O, BaO, ZrO2, and MgO in relatively precise amounts.
Abstract translation:特别适用于具有基本上与陶瓷材料的热膨胀系数匹配的热膨胀系数和小于4.5的低介电常数的电子模块应用中的陶瓷材料的玻璃组合物。 该组合物是基本上由相对精确量的SiO 2,B 2 O 3,CaO,Al 2 O 3,Na 2 O,K 2 O,BaO,ZrO 2和MgO组成的硼硅酸盐玻璃。
Abstract:
A family of dielectric glasses having properties such that, when heat is applied to seal the dielectric glasses, there is no crazing in a MgO overcoat. These dielectric glasses have such viscosity properties as not to craze a MgO overcoat at a temperature of about 480*C corresponding approximately to log viscosity of 10.3 poises and yet fire into good dielectric films at about 610*C. The glass has substantially the following constitutents:
Abstract:
A family of dielectric glasses having properties such that, when heat is applied to seal the dielectric glasses, there is no crazing in a MgO overcoat. These dielectric glasses have such viscosity properties as not to craze a MgO overcoat in the range 455 to 505*C corresponding to log viscosity of 10.3 poises and yet fire into good dielectric films at about 600*C. The glass has substantially the following constituents:
Abstract:
A process for manufacturing a sealing glass composition consisting essentially of the following ingredients in the following proportions:
The process comprises the steps of providing the batch of ingredients to the above proportions and insuring a full mixture or mixing of the same. Thereafter, in one embodiment of the process, the batch may be heated to between 750 and 850*C to form a liquid melt and then the liquid melt is further heated until the temperature is 1,100 + OR - 20*C. The temperature of the melt is held between the aforementioned limits for a period of at least 3 hours and no longer than 3 1/2 hours, and thereafter the temperature of the melt is lowered to effectively inhibit bubbling of the liquid melt, and then the melt is removed for further processing.