Low-temperature tellurite glass mixtures for vacuum compaction at temperatures of 450 degrees C or less

    公开(公告)号:US10745317B2

    公开(公告)日:2020-08-18

    申请号:US16301008

    申请日:2017-04-11

    申请人: Ferro GmbH

    摘要: The present invention relates to a glass, in particular a glass for joining glass panes in order to produce vacuum insulated glasses at processing temperatures of ≤450° C., to the corresponding composite glass, and to the corresponding glass paste. The present invention further relates to a vacuum insulated glass produced by means of the glass paste according to the invention, to the production process thereof, and to the use of the glass according to the invention or of the composite glass and of the glass paste. The glass according to the invention is characterized in that said glass comprises the following components in wt %: TeO2—V2O5 glass in the range of 60-100 wt %, high temperature glasses, selected from the group consisting of lead glass, bismuth glass, zinc glass, barium glass, calcium glass, alkali silicate glass, in the range of 0-20 wt %, and reactive oxides, selected from the group consisting of Al2O3, Y2O3, La2O3, ZnO, Bi2O3, SiO2, ZrO2, zircon, Nb2O5, V2O5, TeO2, CeO2, SnO, SnO2, FeO, MnO, Cr2O3, CoO, oxide pigments, or a combination thereof, in the range of 0-20 wt %.

    Glass composition for micro-D connector sealing

    公开(公告)号:US10723648B2

    公开(公告)日:2020-07-28

    申请号:US15573724

    申请日:2016-05-19

    申请人: AXON CABLE

    摘要: The present invention relates to a tellurium-oxide-based glass composition for forming a glass-to-metal seal to alloys or metals having a coefficient of thermal expansion higher than 16 ppm/° C., said composition comprising TeO2, ZnO, TiO2 and optionally K2O and being essentially free of lead oxide, sodium oxide and vanadium oxide.In addition it relates to the use of the glass composition according to the invention to form a glass-to-metal seal between copper or a copper alloy and an alloy or a metal having a coefficient of thermal expansion higher than 16 ppm/° C., in particular aluminum alloys.It furthermore relates to a connector comprising a contact made of copper or of copper alloy, an insert and/or shell made of a metal or alloy having a coefficient of thermal expansion higher than 16 ppm/° C. and, by way of glass-to-metal sealant between the contact and the insert and/or shell, a tellurium-oxide-based glass having the composition according to the invention.Lastly, it relates to a process for forming a glass-to-metal seal between a contact made of copper or of copper alloy and an insert and/or shell made of metal or alloy having a coefficient of thermal expansion higher than 16 ppm/° C.

    GLASS COMPOSITION FOR MICRO-D CONNECTOR SEALING

    公开(公告)号:US20190337836A1

    公开(公告)日:2019-11-07

    申请号:US15573724

    申请日:2016-05-19

    申请人: AXON CABLE

    摘要: The present invention relates to a tellurium-oxide-based glass composition for forming a glass-to-metal seal to alloys or metals having a coefficient of thermal expansion higher than 16 ppm/° C., said composition comprising TeO2, ZnO, TiO2 and optionally K2O and being essentially free of lead oxide, sodium oxide and vanadium oxide.In addition it relates to the use of the glass composition according to the invention to form a glass-to-metal seal between copper or a copper alloy and an alloy or a metal having a coefficient of thermal expansion higher than 16 ppm/° C., in particular aluminum alloys.It furthermore relates to a connector comprising a contact made of copper or of copper alloy, an insert and/or shell made of a metal or alloy having a coefficient of thermal expansion higher than 16 ppm/° C. and, by way of glass-to-metal sealant between the contact and the insert and/or shell, a tellurium-oxide-based glass having the composition according to the invention.Lastly, it relates to a process for forming a glass-to-metal seal between a contact made of copper or of copper alloy and an insert and/or shell made of metal or alloy having a coefficient of thermal expansion higher than 16 ppm/° C.