公开(公告)号：US20130237005A1

公开(公告)日：2013-09-12

申请号：US13869764

申请日：2013-04-24

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Teng-Yu WANG ,  Chien-Hsun CHEN ,  Chen-Hsun DU ,  Chung-Yuan KUNG

IPC: H01L31/18 ,  H01L21/20

CPC classification number: H01L31/18 ,  H01L21/20 ,  H01L31/02363 ,  H01L31/068 ,  Y02E10/52 ,  Y02E10/547

Abstract: The disclosure provides a method for fabricating a semiconductor layer having a textured surface, including: (a) providing a textured substrate; (b) forming at least one semiconductor layer on the textured substrate; (c) forming a metal layer on the semiconductor layer; and (d) conducting a thermal process or a low temperature process to the textured substrate, the semiconductor layer and the metal layer, wherein the semiconductor layer is separated from the textured substrate by the thermal process to obtain the semiconductor layer having the metal layer and a textured surface.

Abstract translation: 本公开提供了一种用于制造具有纹理表面的半导体层的方法，包括：（a）提供纹理化衬底; （b）在纹理化衬底上形成至少一个半导体层; （c）在半导体层上形成金属层; 和（d）对纹理化衬底，半导体层和金属层进行热处理或低温工艺，其中半导体层通过热处理与纹理化衬底分离，以获得具有金属层的半导体层和 纹理表面。