公开(公告)号：US11243520B2

公开(公告)日：2022-02-08

申请号：US16523905

申请日：2019-07-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chih Chung Chiu ,  Chih Ming Shen ,  Ming Ji Dai

IPC: G05B23/02 ,  G05B19/418 ,  G06K9/62

Abstract: A human-machine interface (HMI) system comprises a local operation device, a display device, a HMI display control device and a communication control device. The local operation device generates a local operation signal. The display device shows a display image corresponding to a display signal. The HMI display control device generates the display signal according to the local operation signal or a remote operation signal. The communication control device comprises a wireless communication connection port for connecting with a remote operation device. The communication control device transmits the local operation signal to the HMI display control device, transmits the display signal to the display device, and selectively transmits the display signal to the remote operation device. The communication control device outputs the remote operation signal to the HMI display control device when the communication control device determines itself receives the remote operation signal but does not receive the local operation signal.

公开(公告)号：US11239141B2

公开(公告)日：2022-02-01

申请号：US17031486

申请日：2020-09-24

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ren-Shin Cheng ,  Shih-Hsien Wu ,  Yu-Wei Huang ,  Chih Ming Shen ,  Yi-Chieh Tsai

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/28 ,  H01L21/00 ,  H01L21/44 ,  H05K5/02 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.