公开(公告)号：US11239141B2

公开(公告)日：2022-02-01

申请号：US17031486

申请日：2020-09-24

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ren-Shin Cheng ,  Shih-Hsien Wu ,  Yu-Wei Huang ,  Chih Ming Shen ,  Yi-Chieh Tsai

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/28 ,  H01L21/00 ,  H01L21/44 ,  H05K5/02 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.

公开(公告)号：US12027470B2

公开(公告)日：2024-07-02

申请号：US17547200

申请日：2021-12-09

Applicant: Industrial Technology Research Institute

Inventor： Yu-Min Lin ,  Ching-Kuan Lee ,  Chao-Jung Chen ,  Ren-Shin Cheng ,  Ang-Ying Lin ,  Po-Chih Chang

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/15 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L21/481 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/56 ,  H01L21/568 ,  H01L23/15 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/14 ,  H01L24/17

Abstract: A package carrier, including a first redistribution structure layer, multiple conductive connecting members, a connection structure layer, at least one stiffener, and a molding compound, is provided. The conductive connecting members are disposed on a first surface of the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The connection structure layer is disposed on a second surface of the first redistribution structure layer and includes a substrate and multiple pads. A top surface and a bottom surface of each pad are respectively exposed to an upper surface and a lower surface of the substrate. The pads are electrically connected to the first redistribution structure layer. The stiffener is disposed on the first surface and is located at least between the conductive connecting members. The molding compound is disposed on the first surface and covers the conductive connecting members and the stiffener.

公开(公告)号：US20220367385A1

公开(公告)日：2022-11-17

申请号：US17547200

申请日：2021-12-09

Applicant: Industrial Technology Research Institute

Inventor： Yu-Min Lin ,  Ching-Kuan Lee ,  Chao-Jung Chen ,  Ren-Shin Cheng ,  Ang-Ying Lin ,  Po-Chih Chang

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/15 ,  H01L21/48 ,  H01L21/56

Abstract: A package carrier, including a first redistribution structure layer, multiple conductive connecting members, a connection structure layer, at least one stiffener, and a molding compound, is provided. The conductive connecting members are disposed on a first surface of the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The connection structure layer is disposed on a second surface of the first redistribution structure layer and includes a substrate and multiple pads. A top surface and a bottom surface of each pad are respectively exposed to an upper surface and a lower surface of the substrate. The pads are electrically connected to the first redistribution structure layer. The stiffener is disposed on the first surface and is located at least between the conductive connecting members. The molding compound is disposed on the first surface and covers the conductive connecting members and the stiffener.

公开(公告)号：US09706656B2

公开(公告)日：2017-07-11

申请号：US14950584

申请日：2015-11-24

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chien-Min Hsu ,  Shih-Hsien Wu ,  Jing-Yao Chang ,  Tao-Chih Chang ,  Ren-Shin Cheng ,  Min-Lin Lee

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K1/116 ,  H05K1/0251 ,  H05K3/42 ,  H05K2201/0187 ,  H05K2201/09545 ,  H05K2203/1105 ,  H05K2203/1178 ,  H05K2203/143 ,  H05K2203/1438

Abstract: A signal transmission board includes a substrate, a conductive via, a cavity and a connecting hole. The substrate has a first external surface and a second external surface. The conductive via penetrating through the substrate has a first end and a second end. The first end is disposed on the first external surface, and the second end is disposed on the second external surface. The cavity is disposed in the substrate and penetrated by the conductive via. The connecting hole disposed on the substrate has a third end and a fourth end. The third end is disposed on the first external surface, and the fourth end communicates with the cavity.