公开(公告)号：US20160102165A1

公开(公告)日：2016-04-14

申请号：US14881993

申请日：2015-10-13

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Cheng-Han HSIEH ,  Hung-Jie LIOU

IPC: C08G8/32 ,  C08L77/02 ,  C08L63/04

CPC classification number: C08G8/32 ,  C08G8/04 ,  C08G8/06 ,  C08L63/04 ,  C08L77/02 ,  C09D163/00 ,  C08L61/14

Abstract: A HMF-based phenol formaldehyde resin is provided. The HMF-based phenol formaldehyde resin has the formula In the formula, A includes non-substituted phenol, m-cresol, p-cresol, hydroquinone or disubstituted phenol, B includes phosphate ester, phosphate, phosphine oxide, phosphinate ester or phosphinate, and n is 3-20, wherein the disubstituted phenol has substituted groups including H, halide, C1-C20 alkyl group, C1-C20 alkenyl group, C1-C20 cycloalkyl group, C1-C20 cycloalkenyl group, homocyclic aromatic group or heterocyclic aromatic group.

Abstract translation: 提供了基于HMF的酚醛树脂。 基于HMF的酚醛树脂具有下式：在该式中，A包括非取代苯酚，间甲酚，对甲酚，氢醌或二取代苯酚，B包括磷酸酯，磷酸酯，氧化膦，次膦酸酯或次膦酸酯，以及 n为3-20，其中二取代苯酚具有取代基，包括H，卤素，C 1 -C 20烷基，C 1 -C 20烯基，C 1 -C 20环烷基，C 1 -C 20环烯基，杂环芳族基或杂环芳基。