公开(公告)号：US11618822B2

公开(公告)日：2023-04-04

申请号：US17138397

申请日：2020-12-30

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yuan-Chang Huang ,  Shu-Yun Chien ,  Ya-Tin Yu ,  Wei-Cheng Tang

IPC: C08L83/04 ,  C09D183/04 ,  C08G77/20

Abstract: An organic-inorganic hybrid resin is formed by reacting a polyol organic resin with a polysilsesquioxane polymer. The organic-inorganic hybrid resin has T0, T1, T2, and T3 signals of 29Si-NMR, wherein a ratio of the sum of 3 times the integral value of T0 signal and 2 times the integral value of T1 signal and the integral value of T2 signal and the integral value of T3 signal ((3T0+2T1+T2)/T3) is from 0.3 to 1.2, wherein the T0 signal range is 35 ppm to 40 ppm, the T1 signal range is 48 ppm to 53 ppm, the T2 signal range is 55 ppm to 62 ppm, and the T3 signal range is 63 ppm to 72 ppm.

公开(公告)号：US09758624B2

公开(公告)日：2017-09-12

申请号：US14305354

申请日：2014-06-16

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Wei-Cheng Tang ,  Yun-Shan Huang ,  Ya-Tin Yu ,  Yi-Che Su ,  Yuung-Ching Sheen ,  Yuan-Chang Huang

IPC: B05D3/00 ,  C08G77/395 ,  C09D183/04 ,  C09D183/06 ,  C09D183/08 ,  C08G77/30

CPC classification number: C08G77/395 ,  C08G77/30 ,  C09D183/04 ,  C09D183/06 ,  C09D183/08 ,  C08K5/5406

Abstract: A method for forming an inorganic passivation material is provided. The method includes mixing about 5 to 80 parts by weight of trialkoxysilane, about 10 to 80 parts by weight of tetraalkoxysilane, and about 1 to 30 parts by weight of catalyst to perform a reaction at pH of about 0.05 to 4 to form an inorganic resin material. The inorganic resin material is modified by phosphate ester to form an inorganic passivation material, wherein phosphate ester is about 0.1-10 parts by weight based on 100 parts by weight of the inorganic resin material. An inorganic passivation material and a passivation protective film produced therefrom are also provided.

公开(公告)号：US10787590B2

公开(公告)日：2020-09-29

申请号：US16232302

申请日：2018-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kai-Wei Liao ,  Wei-Cheng Tang ,  Yi-Tzu Peng ,  Ya-Tin Yu ,  Yi-Che Su

IPC: C09D163/00 ,  C08L63/00

Abstract: A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of wherein each of R1 is independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be or a combination thereof, wherein each of R2 is independently H or methyl, and each of R3 is independently H or methyl.