公开(公告)号：US11239141B2

公开(公告)日：2022-02-01

申请号：US17031486

申请日：2020-09-24

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ren-Shin Cheng ,  Shih-Hsien Wu ,  Yu-Wei Huang ,  Chih Ming Shen ,  Yi-Chieh Tsai

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/28 ,  H01L21/00 ,  H01L21/44 ,  H05K5/02 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.