公开(公告)号：US09695333B2

公开(公告)日：2017-07-04

申请号：US14807603

申请日：2015-07-23

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Wei-Cheng Tang ,  Su-Mei Chen Wei ,  Yi-Che Su ,  Ya-I Hsu ,  Yi-Tzu Peng

IPC: C08L63/00 ,  C08L67/00 ,  C09D163/00 ,  C08G59/32 ,  C08G59/42

CPC classification number: C09D163/00 ,  C08G59/32 ,  C08G59/4215 ,  C08G59/4276

Abstract: A resin composition formed by reacting a polyester-polyacid oligomer with a poly-epoxy oligomer is provided. The functionality of the resin composition is between 4 and 10. The weight average molecular weight of the resin composition is between 3,000 and 20,000 g/mol.

公开(公告)号：US10787590B2

公开(公告)日：2020-09-29

申请号：US16232302

申请日：2018-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kai-Wei Liao ,  Wei-Cheng Tang ,  Yi-Tzu Peng ,  Ya-Tin Yu ,  Yi-Che Su

IPC: C09D163/00 ,  C08L63/00

Abstract: A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of wherein each of R1 is independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be or a combination thereof, wherein each of R2 is independently H or methyl, and each of R3 is independently H or methyl.