公开(公告)号：US20180192519A1

公开(公告)日：2018-07-05

申请号：US15855808

申请日：2017-12-27

Applicant: INTEL CORPORATION

Inventor： Fay HUA ,  Hong XIE ,  Gregorio R. MURTAGIAN ,  Amit ABRAHAM ,  Alan C. MCALLISTER ,  Ting ZHONG

IPC: H05K1/18 ,  H01R12/52 ,  H05K3/34 ,  H01L23/498 ,  H05K3/40 ,  H01R33/76

CPC classification number: H05K1/181 ,  H01L23/49811 ,  H01L23/49816 ,  H01L2224/00 ,  H01R12/52 ,  H01R33/7607 ,  H05K3/3421 ,  H05K3/4007 ,  H05K2201/10719

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.

公开(公告)号：US20160338199A1

公开(公告)日：2016-11-17

申请号：US14780501

申请日：2014-12-20

Applicant: Intel Corporation

Inventor： Fay HUA ,  Hong XIE ,  Gregorio R. MURTAGIAN ,  Amit ABRAHAM ,  Alan C. MCALLISTER ,  Ting ZHONG

IPC: H05K1/18 ,  H05K3/34 ,  H01L23/498 ,  H05K3/40 ,  H01R12/52 ,  H01R33/76

CPC classification number: H05K1/181 ,  H01L23/49811 ,  H01L23/49816 ,  H01L2224/00 ,  H01R12/52 ,  H01R33/7607 ,  H05K3/3421 ,  H05K3/4007 ,  H05K2201/10719

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及提供用于插座组件中的电连接的焊接触点的技术和配置。 在一个实施例中，焊料接触可以设置在管芯封装的底表面上，使得焊料接触件导电地耦合到管芯封装的电触头。 焊接触点可以被设置成耦合到插座组件的引脚，以提供模具封装的电触点和插座组件的引脚的导电耦合。 可以选择焊料足够软以提供更好的导电性。 引脚还可以被配置为穿透焊接触点以提供更好的导电性。 可以描述和/或要求保护其他实施例。