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    SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYER TO ENABLE HIGH SPEED LAND GRID ARRAY (LGA) SOCKET
    1.
    发明申请
    SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYER TO ENABLE HIGH SPEED LAND GRID ARRAY (LGA) SOCKET 有权

    公开(公告)号：US20220183177A1

    公开(公告)日：2022-06-09

    申请号：US17677785

    申请日：2022-02-22

    Applicant: Intel Corporation

    Inventor： Zhichao ZHANG ,  Gregorio R. MURTAGIAN ,  Kuang C. LIU ,  Kemal AYGUN

    IPC: H05K7/10 ,  H05K1/11 ,  H05K1/02 ,  H01R13/24

    Abstract: Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

    SOCKET LOAD REGULATION UTILIZING CPU CARRIERS WITH SHIM COMPONENTS
    3.
    发明申请
    SOCKET LOAD REGULATION UTILIZING CPU CARRIERS WITH SHIM COMPONENTS 有权

    公开(公告)号：US20210307153A1

    公开(公告)日：2021-09-30

    申请号：US16828447

    申请日：2020-03-24

    Applicant: Intel Corporation

    Inventor： Feroz MOHAMMAD ,  Ralph V. MIELE ,  Thomas BOYD ,  Steven A. KLEIN ,  Gregorio R. MURTAGIAN ,  Eric W. BUDDRIUS ,  Daniel NEUMANN ,  Rolf LAIDO

    IPC: H05K1/02 ,  H01R12/85 ,  H05K1/18

    Abstract: Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

    LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
    6.
    发明申请
    LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS 有权

    公开(公告)号：US20240388018A1

    公开(公告)日：2024-11-21

    申请号：US18199269

    申请日：2023-05-18

    Applicant: Intel Corporation

    Inventor： Karumbu MEYYAPPAN ,  Gregorio R. MURTAGIAN ,  Ziyin LIN

    IPC: H01R12/52 ,  H01L23/498 ,  H01R3/08 ,  H05K1/18 ,  H05K3/32

    Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate with a first surface and a second surface opposite from the first surface. In an embodiment, pads are on the first surface of the package substrate, where the pads have a first width. In an embodiment, a layer is on the first surface of the package substrate, where the layer comprises wells through the layer, and where the wells have a second width that is wider than the first width. In an embodiment, a liquid metal is in the wells and in contact with the pads.

    SOLDER CONTACTS FOR SOCKET ASSEMBLIES
    8.
    发明申请
    SOLDER CONTACTS FOR SOCKET ASSEMBLIES 有权
    焊接组件的焊接接头

    公开(公告)号：US20160338199A1

    公开(公告)日：2016-11-17

    申请号：US14780501

    申请日：2014-12-20

    Applicant: Intel Corporation

    Inventor： Fay HUA ,  Hong XIE ,  Gregorio R. MURTAGIAN ,  Amit ABRAHAM ,  Alan C. MCALLISTER ,  Ting ZHONG

    IPC: H05K1/18 ,  H05K3/34 ,  H01L23/498 ,  H05K3/40 ,  H01R12/52 ,  H01R33/76

    CPC classification number: H05K1/181 ,  H01L23/49811 ,  H01L23/49816 ,  H01L2224/00 ,  H01R12/52 ,  H01R33/7607 ,  H05K3/3421 ,  H05K3/4007 ,  H05K2201/10719

    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例涉及提供用于插座组件中的电连接的焊接触点的技术和配置。 在一个实施例中，焊料接触可以设置在管芯封装的底表面上，使得焊料接触件导电地耦合到管芯封装的电触头。 焊接触点可以被设置成耦合到插座组件的引脚，以提供模具封装的电触点和插座组件的引脚的导电耦合。 可以选择焊料足够软以提供更好的导电性。 引脚还可以被配置为穿透焊接触点以提供更好的导电性。 可以描述和/或要求保护其他实施例。

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