公开(公告)号：US20200218317A1

公开(公告)日：2020-07-09

申请号：US16648595

申请日：2018-01-12

Applicant: Intel Corporation

Inventor： Tao SHU ,  Chuansheng LIU ,  Na CHEN ,  Liguang DU

IPC: G06F1/20 ,  H05K7/20 ,  F28D15/02

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide cooling to a heat source. In embodiments, a first set of cooling fins are thermally coupled to a heat source in a first orientation to allow first airflow to pass through in between the first set of cooling fins to dissipate heat from the heat source. A second set of cooling fins thermally coupled to the heat source in a second orientation to allow second airflow to pass through in between the second set of cooling fins to dissipate heat from the heat source. A barrier may be coupled to the second set of cooling fins to substantially divert the second airflow away from the first airflow about to pass through in between the first set of cooling fins so that pre-heated air does not flow over the first set of cooling fins.

公开(公告)号：US20220139843A1

公开(公告)日：2022-05-05

申请号：US17428565

申请日：2019-04-10

Applicant: INTEL CORPORATION

Inventor： Jun LU ,  Wei LIAO ,  Chen ZHANG ,  Guangying ZHANG ,  Liguang DU ,  Chuansheng LIU ,  Michael LEDDIGE ,  Weimin SHI ,  Eduardo MICHEL ,  Guillermo RENTERIA ZAMUDIO

IPC: H01L23/552 ,  H01L23/00

Abstract: An integrated circuit assembly may be formed having at least one integrated circuit device electrically attached to an electronic substrate. The integrated circuit assembly may further include at least one electromagnetic interference structure attached to the electronic substrate adjacent to the at least one integrated circuit device. The at least one electromagnetic interference structure may be electrically attached to the electronic substrate with at least one resilient connector extending therebetween. In one embodiment, the at least one electromagnetic interference structure may be grounded to the electronic substrate.