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1.发明申请DIRECT LIQUID-CONTACT MICRO-CHANNEL HEAT TRANSFER DEVICES, METHODS OF TEMPERATURE CONTROL FOR SEMICONDUCTIVE DEVICES, AND PROCESSES OF FORMING SAME 审中-公开直接液体接触微通道传热装置，用于半导体装置的温度控制方法及其形成方法公开(公告)号：US20150285857A1
公开(公告)日：2015-10-08
申请号：US14746764
申请日：2015-06-22
Applicant: INTEL CORPORATION
Inventor： Christopher R. SCHROEDER , Christopher W. ACKERMAN , James C. SHIPLEY , Tolga ACIKALIN , Ioan SAUCIUC , Michael L. RUTIGLIANO , James G. MAVEETY , Ashish GUPTA
CPC classification number: G01R31/2875 , F28F3/12 , G01R31/2642 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
Abstract translation: 测试半导体装置的装置包括保持至少一个传热流体单元的基座。 至少一个传热流体单元包括包括供给孔横截面的流体供应结构以及包括回流孔横截面的流体返回结构。 供应孔横截面大于回流孔横截面。 模具界面也被包括为液体不可渗透的材料。
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