公开(公告)号：US20140349091A1

公开(公告)日：2014-11-27

申请号：US14055845

申请日：2013-10-16

Applicant: Industrial Technology Research Institute

Inventor： Jing-Yi Yan ,  Chen-Yu Chiang ,  Wen-Tung Wang ,  Bo-Cheng Kung ,  Hung-Chien Lin ,  Liang-Hsiang Chen

IPC: H01L51/52 ,  G02F1/1335 ,  G02F1/1333 ,  H01L51/00

CPC classification number: H01L51/5256 ,  H01L51/003 ,  H01L51/0097 ,  H01L2251/55 ,  Y02E10/549 ,  Y10T428/24942

Abstract: A thin-film device may include a carrier, a release layer, a stacking structure, and a flexible substrate. The release layer may be overlaid on the carrier, and the stacking structure is overlaid on the release layer. The stacking structure may include a first protective layer and a second protective layer, wherein the refractive index of the first protective layer exceeds that of the second protective layer. The flexible substrate may be overlaid on the release layer.

Abstract translation: 薄膜器件可以包括载体，释放层，堆叠结构和柔性基底。 释放层可以覆盖在载体上，堆叠结构覆盖在释放层上。 堆叠结构可以包括第一保护层和第二保护层，其中第一保护层的折射率超过第二保护层的折射率。 柔性基底可以覆盖在释放层上。

公开(公告)号：US09876193B2

公开(公告)日：2018-01-23

申请号：US14055845

申请日：2013-10-16

Applicant: Industrial Technology Research Institute

Inventor： Jing-Yi Yan ,  Chen-Yu Chiang ,  Wen-Tung Wang ,  Bo-Cheng Kung ,  Hung-Chien Lin ,  Liang-Hsiang Chen

IPC: H01L51/52 ,  H01L51/00

CPC classification number: H01L51/5256 ,  H01L51/003 ,  H01L51/0097 ,  H01L2251/55 ,  Y02E10/549 ,  Y10T428/24942

Abstract: A thin-film device may include a carrier, a release layer, a stacking structure, and a flexible substrate. The release layer may be overlaid on the carrier, and the stacking structure is overlaid on the release layer. The stacking structure may include a first protective layer and a second protective layer, wherein the refractive index of the first protective layer exceeds that of the second protective layer. The flexible substrate may be overlaid on the release layer.