公开(公告)号：US20220141961A1

公开(公告)日：2022-05-05

申请号：US17134132

申请日：2020-12-24

Applicant: Industrial Technology Research Institute

Inventor： Chih-I Wu ,  Shih-Ming Lin ,  Pin-Hao Hu ,  Yu-Chung Lin ,  Hsin-Yu Chang ,  Fu-Lung Chou ,  Chien-Jung Huang

IPC: H05K3/00 ,  H05K1/11

Abstract: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.

公开(公告)号：US11406022B2

公开(公告)日：2022-08-02

申请号：US17134132

申请日：2020-12-24

Applicant: Industrial Technology Research Institute

Inventor： Chih-I Wu ,  Shih-Ming Lin ,  Pin-Hao Hu ,  Yu-Chung Lin ,  Hsin-Yu Chang ,  Fu-Lung Chou ,  Chien-Jung Huang

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H01L23/498

Abstract: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.