公开(公告)号：US11338392B2

公开(公告)日：2022-05-24

申请号：US16279186

申请日：2019-02-19

Applicant: Industrial Technology Research Institute

Inventor： Hsin-Yu Chang ,  Fu-Lung Chou ,  Chien-Jung Huang ,  Yu-Chung Lin ,  Min-Kai Lee

IPC: B23K26/36 ,  B23K26/38 ,  B23K26/40 ,  B23K26/362 ,  B23K103/00 ,  B23K101/36 ,  B23K101/18

Abstract: A cutting method for forming a chamfered corner includes a step of selecting a light pattern-adjusting module according to a pre-cut chamfer angle, a step of the light pattern-adjusting module emitting a laser beam to a substrate and thus forming a modified region extending in a thickness direction at the substrate, a step of the light pattern-adjusting module adjusting an axial energy distribution of a light pattern of the laser beam to vary an appearance of the modified region so as to form the modified region fulfilling the pre-cut chamfer angle, and a step of etching the substrate having the modified region to form a chamfered surface on the substrate by cutting the modified region from the substrate.

公开(公告)号：US20220141961A1

公开(公告)日：2022-05-05

申请号：US17134132

申请日：2020-12-24

Applicant: Industrial Technology Research Institute

Inventor： Chih-I Wu ,  Shih-Ming Lin ,  Pin-Hao Hu ,  Yu-Chung Lin ,  Hsin-Yu Chang ,  Fu-Lung Chou ,  Chien-Jung Huang

IPC: H05K3/00 ,  H05K1/11

Abstract: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.

公开(公告)号：US11406022B2

公开(公告)日：2022-08-02

申请号：US17134132

申请日：2020-12-24

Applicant: Industrial Technology Research Institute

Inventor： Chih-I Wu ,  Shih-Ming Lin ,  Pin-Hao Hu ,  Yu-Chung Lin ,  Hsin-Yu Chang ,  Fu-Lung Chou ,  Chien-Jung Huang

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H01L23/498

Abstract: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.