公开(公告)号：US09786790B2

公开(公告)日：2017-10-10

申请号：US15062222

申请日：2016-03-07

Applicant: Industrial Technology Research Institute

Inventor： Ching-Wen Su ,  Tai-Jui Wang ,  Hsiao-Chiang Yao ,  Tsu-Chiang Chang ,  Bo-Yuan Su

IPC: H01L29/78 ,  H01L29/786 ,  H01L21/324 ,  H01L23/552

CPC classification number: H01L29/78675 ,  H01L21/324 ,  H01L23/552 ,  H01L27/1218 ,  H01L29/78603 ,  H01L29/78633

Abstract: In one embodiment, a flexible device is provided. The flexible device may include a flexible substrate, a buffer layer, a light reflective layer, and a device layer. The buffer layer is located on the flexible substrate. The light reflective layer is located on the flexible substrate, wherein the light reflective layer has a reflection wavelength of 200 nm˜1100 nm, a reflection ratio of greater than 80%, and a stress direction of the light reflective layer is the same as a stress direction of the flexible substrate. The device layer is located on the light reflective layer and the buffer layer.

公开(公告)号：US20170170329A1

公开(公告)日：2017-06-15

申请号：US15062222

申请日：2016-03-07

Applicant: Industrial Technology Research Institute

Inventor： Ching-Wen Su ,  Tai-Jui Wang ,  Hsiao-Chiang Yao ,  Tsu-Chiang Chang ,  Bo-Yuan Su

IPC: H01L29/786 ,  H01L21/324 ,  H01L23/552

CPC classification number: H01L29/78675 ,  H01L21/324 ,  H01L23/552 ,  H01L27/1218 ,  H01L29/78603 ,  H01L29/78633

Abstract: In one embodiment, a flexible device is provided. The flexible device may include a flexible substrate, a buffer layer, a light reflective layer, and a device layer. The buffer layer is located on the flexible substrate. The light reflective layer is located on the flexible substrate, wherein the light reflective layer has a reflection wavelength of 200 nm˜1100 nm, a reflection ratio of greater than 80%, and a stress direction of the light reflective layer is the same as a stress direction of the flexible substrate. The device layer is located on the light reflective layer and the buffer layer.