MAGNETIC AND THERMALLY CONDUCTIVE MATERIAL AND THERMALLY CONDUCTIVE AND DIELECTRIC LAYER

    公开(公告)号:US20170158933A1

    公开(公告)日:2017-06-08

    申请号:US14982834

    申请日:2015-12-29

    CPC classification number: C09K5/14 H01F1/01 H01F1/445

    Abstract: A magnetic and thermally conductive material is provided, which includes a thermally conductive compound powder, and an iron-containing oxide at a surface of the thermally conductive compound powder, wherein the iron-containing oxide is an oxide of iron with an other metal, and the other metal is nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof. A thermally conductive and dielectric layer is also provided, which includes a magnetic and thermally conductive material and a resin, wherein the thermally conductive material includes a thermally conductive compound powder, and an iron-containing oxide at a surface of the thermally conductive compound powder, wherein the iron-containing oxide is an oxide of iron with an other metal, and the other metal is nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof.

    ELECTROSTATIC SENSING SYSTEM AND ELECTROSTATIC SENSING ASSEMBLY

    公开(公告)号:US20210199704A1

    公开(公告)日:2021-07-01

    申请号:US17129675

    申请日:2020-12-21

    Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.

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