公开(公告)号：US20200052243A1

公开(公告)日：2020-02-13

申请号：US16379815

申请日：2019-04-10

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Yung-Hui Yeh ,  Jui-Chang Chuang ,  Li-Ching Wang ,  Cheng-Yueh Chang ,  Chyi-Ming Leu ,  Shih-Ming Chen

IPC: H01L51/52 ,  H01L23/29 ,  G02B1/14

Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

公开(公告)号：US11479689B2

公开(公告)日：2022-10-25

申请号：US17139119

申请日：2020-12-31

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Li-Ching Wang ,  Yuan-Yin Chen

IPC: C09D133/14 ,  C08F220/28 ,  C09D4/00 ,  C09D5/00

Abstract: The present disclosure provides an anti-fogging material and a manufacturing method thereof. The anti-fogging material includes a crosslinked polymer obtained by curing an anti-fogging composition, wherein the anti-fogging composition includes an ionic compound, a hard compound with two or more acrylate functional groups at the terminus thereof, and a surface active compound.

公开(公告)号：US20220204804A1

公开(公告)日：2022-06-30

申请号：US17139119

申请日：2020-12-31

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Li-Ching Wang ,  Yuan-Yin Chen

IPC: C09D133/14 ,  C09D5/00 ,  C09D4/00 ,  C08F220/28

Abstract: The present disclosure provides an anti-fogging material and a manufacturing method thereof. The anti-fogging material includes a crosslinked polymer obtained by curing an anti-fogging composition, wherein the anti-fogging composition includes an ionic compound, a hard compound with two or more acrylate functional groups at the terminus thereof, and a surface active compound.

公开(公告)号：US10964912B2

公开(公告)日：2021-03-30

申请号：US16379815

申请日：2019-04-10

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Yung-Hui Yeh ,  Jui-Chang Chuang ,  Li-Ching Wang ,  Cheng-Yueh Chang ,  Chyi-Ming Leu ,  Shih-Ming Chen

IPC: H01L51/52 ,  H01L23/29 ,  G02B1/14 ,  H01L27/32

Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

公开(公告)号：US09796874B2

公开(公告)日：2017-10-24

申请号：US14534233

申请日：2014-11-06

Applicant: Industrial Technology Research Institute

Inventor： Sheng-Wei Chen ,  Sin-An Chen ,  Chuan-Hsu Fu ,  Li-Ching Wang ,  Yi-Ling Chen

IPC: C09D133/14 ,  C09D133/06

CPC classification number: C09D133/14 ,  C08L2312/00 ,  C09D133/06

Abstract: According to embodiments of the disclosure, a substrate structure, a method for manufacturing the substrate structure, and a method for manufacturing an electronic device are disclosed. The substrate structure includes a carrier, a de-bonding layer, and a flexible substrate. The carrier has a top surface. The de-bonding layer contacts the carrier, wherein there is a first adhesion force between the de-bonding layer and the carrier. The de-bonding layer is prepared from a composition, and the composition includes at least one acrylate-based monomer and at least one acrylate-based oligomer, wherein the total number of acrylate groups in the acrylate-based monomer and the acrylate-based oligomer is greater than or equal to 3. The flexible substrate covers and contacts the de-bonding layer, wherein there is a second adhesion force between the de-bonding layer and the flexible substrate. The second adhesion force is greater than the first adhesion force.