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    AIR FLOW DISTRIBUTION SYSTEM FOR DATA CENTER SERVER RACKS
    1.
    发明公开
    AIR FLOW DISTRIBUTION SYSTEM FOR DATA CENTER SERVER RACKS 审中-公开

    公开(公告)号：US20230301033A1

    公开(公告)日：2023-09-21

    申请号：US18086577

    申请日：2022-12-21

    Applicant: Inertech IP LLC

    Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell

    IPC: H05K7/20 ,  F21V33/00

    CPC classification number: H05K7/20745 ,  F21V33/0092 ,  F21W2131/40

    Abstract: An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.

    Systems and methods for cooling electrical equipment
    2.
    发明授权
    Systems and methods for cooling electrical equipment 有权

    公开(公告)号：US11555635B2

    公开(公告)日：2023-01-17

    申请号：US16989880

    申请日：2020-08-10

    Applicant: INERTECH IP LLC

    Inventor： Ming Zhang ,  John Costakis

    IPC: F25B25/00 ,  H05K7/20 ,  F25B7/00 ,  F25B49/02

    Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.

    System and methods utilizing fluid coolers and chillers to perform in-sertes heat rejection and trim cooling
    3.
    发明授权
    System and methods utilizing fluid coolers and chillers to perform in-sertes heat rejection and trim cooling 有权

    公开(公告)号：US11415330B2

    公开(公告)日：2022-08-16

    申请号：US16695007

    申请日：2019-11-25

    Applicant: Inertech IP LLC

    Inventor： John Costakis ,  Ming Zhang ,  Earl Keisling ,  Ken Nguyen

    IPC: F24F5/00 ,  F24F11/83 ,  F25B25/00 ,  F25B23/00 ,  F24F110/12 ,  F24F140/50 ,  F24F11/46 ,  F24F13/22 ,  F28C1/00

    Abstract: The cooling systems and methods of the present disclosure involve modular fluid coolers and chillers configured for optimal power and water use based on environmental conditions and client requirements. The fluid coolers include wet media, a first fluid circuit for distributing fluid across wet media, an air to fluid heat exchanger, and an air to refrigerant heat exchanger. The chillers, which are fluidly coupled to the fluid coolers via pipe cages, include a second fluid circuit in fluid communication with the air to fluid heat exchanger and a refrigerant circuit in thermal communication with the second fluid circuit and in fluid communication with the air to refrigerant heat exchanger. Pipe cages are coupled together to allow for expansion of the cooling system when additional cooling capacity is needed. The fluid coolers and chillers are configured to selectively operate in wet or dry free cooling mode, partial free cooling mode, or mechanical cooling mode.

    SYSTEMS AND ASSEMBLIES FOR COOLING SERVER RACKS
    4.
    发明申请
    SYSTEMS AND ASSEMBLIES FOR COOLING SERVER RACKS 审中-公开

    公开(公告)号：US20170374765A1

    公开(公告)日：2017-12-28

    申请号：US15590596

    申请日：2017-05-09

    Applicant: INERTECH IP LLC

    Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell ,  Michael Welch

    IPC: H05K7/20 ,  H05K5/02

    CPC classification number: H05K7/20218 ,  H05K5/02 ,  H05K7/20145 ,  H05K7/20609 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20781 ,  H05K7/2079

    Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

    SYSTEM AND METHODS FOR COOLING ELECTRONIC EQUIPMENT
    6.
    发明申请
    SYSTEM AND METHODS FOR COOLING ELECTRONIC EQUIPMENT 审中-公开
    冷却电子设备的系统和方法

    公开(公告)号：US20160120067A1

    公开(公告)日：2016-04-28

    申请号：US14834746

    申请日：2015-08-25

    Applicant: INERTECH IP LLC

    Inventor： Gerald McDonnell ,  Earl Keisling ,  John Costakis

    IPC: H05K7/20

    CPC classification number: H05K7/20381 ,  F25B31/006 ,  F25B2600/021 ,  H05K7/2029 ,  H05K7/20327 ,  H05K7/20745 ,  H05K7/20827 ,  Y02B30/741 ,  Y10T29/49359

    Abstract: Systems and methods for cooling an inverter of a variable frequency drive that drives a compressor in a cooling system for electronic equipment are disclosed. The system includes a first fluid circuit that cools electronic equipment using a first fluid flowing therethrough and a second fluid circuit that free cools a second fluid flowing therethrough. The second fluid circuit cools the first fluid using the free-cooled second fluid. The system further includes a third fluid circuit that mechanically cools the second fluid using a third fluid flowing therethrough as a function of the wet bulb temperature of atmospheric air. The third fluid circuit includes at least one compressor compresses the third fluid and is driven by a motor coupled to the variable frequency drive. At least a portion of the first fluid flowing through the third fluid circuit is diverted to cool the inverter of the variable frequency drive.

    Abstract translation: 公开了用于冷却驱动电子设备的冷却系统中的压缩机的变频驱动器的逆变器的系统和方法。 该系统包括使用流过其中的第一流体冷却电子设备的第一流体回路，以及第二流体回路，其自由地冷却流过其中的第二流体。 第二流体回路使用自由冷却的第二流体冷却第一流体。 该系统还包括第三流体回路，其使用流过其中的第三流体作为大气空气的湿球温度的函数机械地冷却第二流体。 第三流体回路包括至少一个压缩机压缩第三流体并由耦合到变频驱动器的马达驱动。 流过第三流体回路的第一流体的至少一部分被转向以冷却变频驱动器的逆变器。

    AIR FLOW DISTRIBUTION SYSTEM FOR DATA CENTER SERVER RACKS
    9.
    发明申请
    AIR FLOW DISTRIBUTION SYSTEM FOR DATA CENTER SERVER RACKS 有权

    公开(公告)号：US20210076538A1

    公开(公告)日：2021-03-11

    申请号：US16928633

    申请日：2020-07-14

    Applicant: Inertech IP LLC

    Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell

    IPC: H05K7/20 ,  F21V33/00

    Abstract: An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.

    Systems and assemblies for cooling server racks
    10.
    发明授权
    Systems and assemblies for cooling server racks 有权

    公开(公告)号：US09648784B2

    公开(公告)日：2017-05-09

    申请号：US14216005

    申请日：2014-03-17

    Applicant: Inertech IP LLC

    Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell ,  Michael Welch

    IPC: H05K7/20 ,  G06F1/20

    CPC classification number: H05K7/20609 ,  H05K5/02 ,  H05K7/20745 ,  H05K7/2079

    Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

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