公开(公告)号：US20170374765A1

公开(公告)日：2017-12-28

申请号：US15590596

申请日：2017-05-09

Applicant: INERTECH IP LLC

Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell ,  Michael Welch

IPC: H05K7/20 ,  H05K5/02

CPC classification number: H05K7/20218 ,  H05K5/02 ,  H05K7/20145 ,  H05K7/20609 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20781 ,  H05K7/2079

Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

公开(公告)号：USD792389S1

公开(公告)日：2017-07-18

申请号：US29556224

申请日：2016-02-29

Applicant: Inertech IP LLC

Designer： Earl Keisling ,  John Costakis ,  Michael Welch

公开(公告)号：US09648784B2

公开(公告)日：2017-05-09

申请号：US14216005

申请日：2014-03-17

Applicant: Inertech IP LLC

Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell ,  Michael Welch

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20609 ,  H05K5/02 ,  H05K7/20745 ,  H05K7/2079

Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

公开(公告)号：US20230363106A1

公开(公告)日：2023-11-09

申请号：US18118357

申请日：2023-03-07

Applicant: INERTECH IP LLC

Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell ,  Michael Welch

IPC: H05K7/20 ,  H05K5/02

CPC classification number: H05K7/20218 ,  H05K5/02 ,  H05K7/20736 ,  H05K7/20781 ,  H05K7/20145 ,  H05K7/20609 ,  H05K7/20745 ,  H05K7/2079

Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

公开(公告)号：US11602074B2

公开(公告)日：2023-03-07

申请号：US16653509

申请日：2019-10-15

Applicant: Inertech IP LLC

Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell ,  Michael Welch

IPC: H05K7/20 ,  H05K5/02

Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

公开(公告)号：USD744996S1

公开(公告)日：2015-12-08

申请号：US29449647

申请日：2013-03-15

Applicant: INERTECH IP LLC

Designer： Earl Keisling ,  John Costakis ,  Michael Welch

公开(公告)号：US10448539B2

公开(公告)日：2019-10-15

申请号：US15590596

申请日：2017-05-09

Applicant: INERTECH IP LLC

Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell ,  Michael Welch

IPC: H05K7/20 ,  H05K5/02

Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

公开(公告)号：US20200163250A1

公开(公告)日：2020-05-21

申请号：US16653509

申请日：2019-10-15

Applicant: Inertech IP LLC

Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell ,  Michael Welch

IPC: H05K7/20 ,  H05K5/02

Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.