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公开(公告)号:US20230125452A1
公开(公告)日:2023-04-27
申请号:US17509746
申请日:2021-10-25
发明人: Ryan Tordillo Comadre , Victor Dela Cruz Del Rosario , Bernie Tabanao Rosales , Subaramaniym Senivasan , Heng Chen Tang
IPC分类号: H01L23/40
摘要: A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.