公开(公告)号：US12191229B2

公开(公告)日：2025-01-07

申请号：US17509746

申请日：2021-10-25

Applicant: Infineon Technologies AG

Inventor： Ryan Tordillo Comadre ,  Victor Dela Cruz Del Rosario ,  Bernie Tabanao Rosales ,  Subaramaniym Senivasan ,  Heng Chen Tang

IPC: H01L23/40 ,  H01L23/00

Abstract: A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.

公开(公告)号：US20220068770A1

公开(公告)日：2022-03-03

申请号：US17010426

申请日：2020-09-02

Applicant: Infineon Technologies AG

Inventor： Emil Lamco Jocson ,  Mohd Kahar Bajuri ,  Ryan Tordillo Comadre

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48

Abstract: A semiconductor package assembly includes a carrier with a die attach surface and a contact pad separated from the die attach surface, a semiconductor die mounted on the die attach surface, the semiconductor die having a front side metallization that faces away from the die attach surface, an interconnect ribbon attached to the semiconductor die and the contact pad such that the interconnect ribbon electrically connects the front side metallization to the contact pad, and an electrically insulating encapsulant body that encapsulates the semiconductor die and at least part of the interconnect ribbon. The interconnect ribbon includes a layer stack of a first metal layer and a second layer formed on top of the first metal layer. The first metal layer includes a different metal as the second metal layer. The first metal layer faces the front side metallization.

公开(公告)号：US11705387B2

公开(公告)日：2023-07-18

申请号：US17010426

申请日：2020-09-02

Applicant: Infineon Technologies AG

Inventor： Emil Lamco Jocson ,  Mohd Kahar Bajuri ,  Ryan Tordillo Comadre

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/49527 ,  H01L21/4825 ,  H01L23/3157 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49582

Abstract: A semiconductor package assembly includes a carrier with a die attach surface and a contact pad separated from the die attach surface, a semiconductor die mounted on the die attach surface, the semiconductor die having a front side metallization that faces away from the die attach surface, an interconnect ribbon attached to the semiconductor die and the contact pad such that the interconnect ribbon electrically connects the front side metallization to the contact pad, and an electrically insulating encapsulant body that encapsulates the semiconductor die and at least part of the interconnect ribbon. The interconnect ribbon includes a layer stack of a first metal layer and a second layer formed on top of the first metal layer. The first metal layer includes a different metal as the second metal layer. The first metal layer faces the front side metallization.

公开(公告)号：US20230125452A1

公开(公告)日：2023-04-27

申请号：US17509746

申请日：2021-10-25

Applicant: Infineon Technologies AG

Inventor： Ryan Tordillo Comadre ,  Victor Dela Cruz Del Rosario ,  Bernie Tabanao Rosales ,  Subaramaniym Senivasan ,  Heng Chen Tang

IPC: H01L23/40

Abstract: A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.