公开(公告)号：US20240145340A1

公开(公告)日：2024-05-02

申请号：US18406832

申请日：2024-01-08

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Angel Enverge ,  Chii Shang Hong ,  Chee Ming Lam ,  Sanjay Kumar Murugan ,  Subaramaniym Senivasan

IPC: H01L23/433 ,  H01L23/00 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L23/4334 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49811 ,  H01L24/84 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/40 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/40175 ,  H01L2224/73263

Abstract: A molded semiconductor package includes: a semiconductor die; a substrate attached to a first side of the semiconductor die; a plurality of leads electrically connected to a second side of the semiconductor die opposite the first side; a heat sink clip thermally coupled to a pad at the second side of the semiconductor die; and a molding compound encapsulating the die, part of the leads, part of the heat sink clip, and at least part of the substrate. The molding compound has a first main side, a second main side opposite the first main side and at which the substrate is disposed, and an edge extending between the first main side and the second main side. The leads protrude from opposing first and second faces of the edge of the molding compound. The heat sink clip protrudes from opposing third and fourth faces of the edge of the molding compound.

公开(公告)号：US09196521B2

公开(公告)日：2015-11-24

申请号：US13669339

申请日：2012-11-05

Applicant: Infineon Technologies AG

Inventor： Abdul Rahman Mohamed ,  Subaramaniym Senivasan ,  Zakaria Abdullah ,  Ralf Otremba

IPC: H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6838 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/75702 ,  H01L2224/75823 ,  H01L2224/8382 ,  H01L2224/8385 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T29/49716 ,  Y10T29/49826 ,  Y10T29/53174 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a shank having a holder and an intermediate body connected to the holder by a first joint. The pick-up head further includes a collet head connected to the intermediate body by a second joint.

Abstract translation: 公开了一种可调节拾取头，夹头，调节拾取头的方法和制造装置的方法。 在一个实施例中，拾取头包括具有保持器的柄和通过第一接头连接到保持器的中间体。 拾取头还包括通过第二关节连接到中间体的夹头。

公开(公告)号：US20230154827A1

公开(公告)日：2023-05-18

申请号：US17524879

申请日：2021-11-12

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Angel Enverga ,  Chii Shang Hong ,  Chee Ming Lam ,  Sanjay Kumar Murugan ,  Subaramaniym Senivasan

IPC: H01L23/433 ,  H01L23/495

CPC classification number: H01L23/4334 ,  H01L23/49568 ,  H01L24/40

Abstract: A molded semiconductor package includes: a semiconductor die; a substrate attached to a first side of the semiconductor die; a plurality of leads electrically connected to a pad at a second side of the semiconductor die opposite the first side; a heat sink clip thermally coupled to the pad; and a molding compound encapsulating the semiconductor die, part of the leads, part of the heat sink clip, and at least part of the substrate. The molding compound has a first main side, a second main side opposite the first main side and at which the substrate is disposed, and an edge extending between the first main side and the second main side. The leads protrude from opposing first and second faces of the edge of the molding compound. The heat sink clip protrudes from opposing third and fourth faces of the edge of the molding compound.

公开(公告)号：US20230125452A1

公开(公告)日：2023-04-27

申请号：US17509746

申请日：2021-10-25

Applicant: Infineon Technologies AG

Inventor： Ryan Tordillo Comadre ,  Victor Dela Cruz Del Rosario ,  Bernie Tabanao Rosales ,  Subaramaniym Senivasan ,  Heng Chen Tang

IPC: H01L23/40

Abstract: A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.

公开(公告)号：US11908771B2

公开(公告)日：2024-02-20

申请号：US17524879

申请日：2021-11-12

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Angel Enverga ,  Chii Shang Hong ,  Chee Ming Lam ,  Sanjay Kumar Murugan ,  Subaramaniym Senivasan

IPC: H01L23/433 ,  H01L23/495 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/4334 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49811 ,  H01L24/84 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/40 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/40175 ,  H01L2224/73263

Abstract: A molded semiconductor package includes: a semiconductor die; a substrate attached to a first side of the semiconductor die; a plurality of leads electrically connected to a pad at a second side of the semiconductor die opposite the first side; a heat sink clip thermally coupled to the pad; and a molding compound encapsulating the semiconductor die, part of the leads, part of the heat sink clip, and at least part of the substrate. The molding compound has a first main side, a second main side opposite the first main side and at which the substrate is disposed, and an edge extending between the first main side and the second main side. The leads protrude from opposing first and second faces of the edge of the molding compound. The heat sink clip protrudes from opposing third and fourth faces of the edge of the molding compound.

公开(公告)号：US20140123454A1

公开(公告)日：2014-05-08

申请号：US13669339

申请日：2012-11-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Abdul Rahman Mohamed ,  Subaramaniym Senivasan ,  Zakaria Abdullah ,  Ralf Otremba

IPC: B23P19/00 ,  B23P11/00

CPC classification number: H01L21/6838 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/75702 ,  H01L2224/75823 ,  H01L2224/8382 ,  H01L2224/8385 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T29/49716 ,  Y10T29/49826 ,  Y10T29/53174 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a shank having a holder and an intermediate body connected to the holder by a first joint. The pick-up head further includes a collet head connected to the intermediate body by a second joint.

Abstract translation: 公开了一种可调节拾取头，夹头，调节拾取头的方法和制造装置的方法。 在一个实施例中，拾取头包括具有保持器的柄和通过第一接头连接到保持器的中间体。 拾取头还包括通过第二关节连接到中间体的夹头。

公开(公告)号：US20250105102A1

公开(公告)日：2025-03-27

申请号：US18823912

申请日：2024-09-04

Applicant: Infineon Technologies AG

Inventor： Roman Künstler-Boschke ,  Wen-Mei Lin ,  Stefan Beyer ,  Subaramaniym Senivasan

IPC: H01L23/495 ,  H01L23/00

Abstract: A power semiconductor device includes: a die carrier; a power semiconductor die arranged on the die carrier and having a first side and an opposite second side, the first side facing away from the die carrier and including a first power terminal having a Cu layer and the second side including a second power terminal electrically coupled to the die carrier; a contact clip electrically coupled to the Cu layer of the first power terminal by a solder joint; and a patterned cover layer deposited on the first side of the power semiconductor die. The cover layer surrounds the first power terminal on at least one lateral side. The cover layer is arranged over the Cu layer. The cover layer consists of Al2O3 or SiO2.

公开(公告)号：US12191229B2

公开(公告)日：2025-01-07

申请号：US17509746

申请日：2021-10-25

Applicant: Infineon Technologies AG

Inventor： Ryan Tordillo Comadre ,  Victor Dela Cruz Del Rosario ,  Bernie Tabanao Rosales ,  Subaramaniym Senivasan ,  Heng Chen Tang

IPC: H01L23/40 ,  H01L23/00

Abstract: A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.

公开(公告)号：US20240250056A1

公开(公告)日：2024-07-25

申请号：US18098979

申请日：2023-01-19

Applicant: Infineon Technologies AG

Inventor： Mohd Afiz Hashim ,  Zhi Yuan Goh ,  Subaramaniym Senivasan ,  Azmil Abdullah ,  Varun Parthasarathy ,  Kah Wai Lau ,  Ahmad Zulkarnain Samsudin

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L24/40 ,  H01L23/3107 ,  H01L23/49517 ,  H01L24/05 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05005 ,  H01L2224/40175 ,  H01L2224/48247 ,  H01L2224/73271 ,  H01L2924/01029 ,  H01L2924/014

Abstract: A semiconductor package includes: a substrate having a metallic surface; a semiconductor die metallurgically bonded to the metallic surface of the substrate by a first solder joint; and a solder wetting structure metallurgically welded to the metallic surface of the substrate outside a perimeter of the semiconductor die and adjacent to one or more side faces of the semiconductor die. Excess solder squeezed out from under the semiconductor die is metallurgically bonded to the solder wetting structure. Methods of producing the semiconductor package and solder wetting structure are also described.