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    Wafer releasing
    2.
    发明授权
    Wafer releasing 有权

    公开(公告)号：US10186445B2

    公开(公告)日：2019-01-22

    申请号：US15209390

    申请日：2016-07-13

    Applicant: Infineon Technologies AG

    Inventor： Mathias Male ,  Christian Maier ,  Philemon Schweizer ,  Manfred Bucher ,  Thomas Steiner

    IPC: H01L21/683 ,  G03F7/20 ,  C23C16/458 ,  H01L21/687 ,  H02N13/00

    Abstract: Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.

    SUBSTRATE PROCESSING CHAMBER AND PROCESS GAS FLOW DEFLECTOR FOR USE IN THE PROCESSING CHAMBER
    3.
    发明申请
    SUBSTRATE PROCESSING CHAMBER AND PROCESS GAS FLOW DEFLECTOR FOR USE IN THE PROCESSING CHAMBER 有权

    公开(公告)号：US20220018023A1

    公开(公告)日：2022-01-20

    申请号：US17370386

    申请日：2021-07-08

    Applicant: Infineon Technologies AG

    Inventor： Matthias Kuenle ,  Olaf Fiedler ,  Thomas Huber ,  Christian Illemann ,  Mathias Male

    IPC: C23C16/455 ,  C23C16/46

    Abstract: A processing chamber includes a chamber body, a substrate support configured to hold a substrate in place, and a pre-heat ring having a central opening sized to be disposed around the substrate. A process gas inlet is configured to direct process gas in a lateral direction to flow over the pre-heat ring and the substrate. A process gas flow deflector includes a radially outer mounting portion and a radially inner blade-shaped process gas deflection portion extending in a radial direction. The radially inner blade-shaped process gas deflection portion is shaped as a ring segment. The radially inner blade-shaped process gas deflection portion is disposed above the process gas inlet and dimensioned to overlap with the pre-heat ring, wherein a degree of overlap between the pre-heat ring and process gas flow deflector in the radial direction is at least ½ of the radial dimension of the pre-heat ring.

    Wafer releasing
    5.
    发明授权
    Wafer releasing 有权
    晶圆释放

    公开(公告)号：US09410249B2

    公开(公告)日：2016-08-09

    申请号：US14279137

    申请日：2014-05-15

    Applicant: Infineon Technologies AG

    Inventor： Mathias Male ,  Christian Maier ,  Philemon Schweizer ,  Manfred Bucher ,  Thomas Steiner

    IPC: H01L21/683 ,  C23C16/458 ,  H01L21/687 ,  H02N13/00

    CPC classification number: H01L21/6833 ,  C23C16/458 ,  C23C16/4585 ,  G03F7/707 ,  H01L21/6831 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68785 ,  H02N13/00

    Abstract: Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.

    Abstract translation: 本发明的实施例提供一种用于处理包括第一和第二主表面的晶片的卡盘系统。 卡盘系统包括卡盘，卡盘构造成将晶片保持在面向卡盘的第二主表面和释放装置。 卡盘系统还包括构造成将释放装置提升离开卡盘的致动器。 释放装置构造成使得释放装置在被提升时在晶片的第二主表面的边缘部分处与晶片机械地接合，从而将晶片从卡盘释放。

    Wafer Releasing
    6.
    发明申请
    Wafer Releasing 有权
    晶圆释放

    公开(公告)号：US20150332951A1

    公开(公告)日：2015-11-19

    申请号：US14279137

    申请日：2014-05-15

    Applicant: Infineon Technologies AG

    Inventor： Mathias Male ,  Christian Maier ,  Philemon Schweizer ,  Manfred Bucher ,  Thomas Steiner

    IPC: H01L21/683

    CPC classification number: H01L21/6833 ,  C23C16/458 ,  C23C16/4585 ,  G03F7/707 ,  H01L21/6831 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68785 ,  H02N13/00

    Abstract: Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.

    Abstract translation: 本发明的实施例提供一种用于处理包括第一和第二主表面的晶片的卡盘系统。 卡盘系统包括卡盘，卡盘构造成将晶片保持在面向卡盘的第二主表面和释放装置。 卡盘系统还包括构造成将释放装置提升离开卡盘的致动器。 释放装置构造成使得释放装置在被提升时在晶片的第二主表面的边缘部分处与晶片机械地接合，从而将晶片从卡盘释放。

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