公开(公告)号：US08907444B2

公开(公告)日：2014-12-09

申请号：US13750919

申请日：2013-01-25

Applicant: Infineon Technologies AG

Inventor： Alois Gutmann ,  Roland Hampp ,  Scott Jansen

IPC: H01L21/762 ,  H01L29/06 ,  H01L29/78 ,  H01L29/12

CPC classification number: H01L29/7846 ,  H01L21/76232 ,  H01L29/06 ,  H01L29/0653 ,  H01L29/12 ,  H01L29/78 ,  H01L29/7848

Abstract: Stress-inducing structures, methods, and materials are disclosed. In one embodiment, an isolation region includes an insulating material in a lower portion of a trench formed in a workpiece and a stress-inducing material disposed in a top portion of the trench over the insulating material.

Abstract translation: 公开了应力诱导结构，方法和材料。 在一个实施例中，隔离区域包括在工件中形成的沟槽的下部中的绝缘材料和设置在绝缘材料上方的沟槽顶部的应力诱导材料。

公开(公告)号：US09373717B2

公开(公告)日：2016-06-21

申请号：US14565243

申请日：2014-12-09

Applicant: Infineon Technologies AG

Inventor： Alois Gutmann ,  Roland Hampp ,  Scott Jansen

IPC: H01L21/762 ,  H01L29/78 ,  H01L29/06 ,  H01L29/12

CPC classification number: H01L29/7846 ,  H01L21/76232 ,  H01L29/06 ,  H01L29/0653 ,  H01L29/12 ,  H01L29/78 ,  H01L29/7848

Abstract: Stress-inducing structures, methods, and materials are disclosed. In one embodiment, an isolation region includes an insulating material in a lower portion of a trench formed in a workpiece and a stress-inducing material disposed in a top portion of the trench over the insulating material.

公开(公告)号：US20150137253A1

公开(公告)日：2015-05-21

申请号：US14565243

申请日：2014-12-09

Applicant: Infineon Technologies AG

Inventor： Alois Gutmann ,  Roland Hampp ,  Scott Jansen

IPC: H01L29/78 ,  H01L29/06

CPC classification number: H01L29/7846 ,  H01L21/76232 ,  H01L29/06 ,  H01L29/0653 ,  H01L29/12 ,  H01L29/78 ,  H01L29/7848

Abstract: Stress-inducing structures, methods, and materials are disclosed. In one embodiment, an isolation region includes an insulating material in a lower portion of a trench formed in a workpiece and a stress-inducing material disposed in a top portion of the trench over the insulating material.

Abstract translation: 公开了应力诱导结构，方法和材料。 在一个实施例中，隔离区域包括在工件中形成的沟槽的下部中的绝缘材料和设置在绝缘材料上方的沟槽顶部的应力诱导材料。

公开(公告)号：US20130134420A1

公开(公告)日：2013-05-30

申请号：US13750919

申请日：2013-01-25

Applicant: Infineon Technologies AG

Inventor： Alois Gutmann ,  Roland Hampp ,  Scott Jansen

IPC: H01L29/06 ,  H01L29/12

CPC classification number: H01L29/7846 ,  H01L21/76232 ,  H01L29/06 ,  H01L29/0653 ,  H01L29/12 ,  H01L29/78 ,  H01L29/7848

Abstract: Stress-inducing structures, methods, and materials are disclosed. In one embodiment, an isolation region includes an insulating material in a lower portion of a trench formed in a workpiece and a stress-inducing material disposed in a top portion of the trench over the insulating material.