公开(公告)号：US20230413433A1

公开(公告)日：2023-12-21

申请号：US17890242

申请日：2022-08-17

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Cheng-Hsien HO ,  Kuo-Sheng YEH ,  Jui-Jen YUEH

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K1/11 ,  H05K3/4007 ,  H05K1/182

Abstract: An electronic device includes a first electronic unit, a second electronic unit, a bonding pad, an insulating layer and a circuit layer. The bonding pad is disposed between the first electronic unit and the second electronic unit. The insulating layer is disposed corresponding to the first electronic unit, to the second electronic unit and to the bonding pad. The first electronic unit is electrically connected with the second electronic unit through the circuit layer and through the bonding pad.

公开(公告)号：US20230411230A1

公开(公告)日：2023-12-21

申请号：US17815297

申请日：2022-07-27

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Cheng-Hsien HO ,  Kuo-Sheng YEH ,  Ching-Wei CHEN ,  Chin-Ming HUANG

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/3135 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3121 ,  H01L2224/214 ,  H01L2224/244 ,  H01L2224/211 ,  H01L2224/24137 ,  H01L2224/25175 ,  H01L2224/19 ,  H01L2224/82101 ,  H01L24/82

Abstract: An electronic device includes a protective layer, an electronic unit and at least one anchor structure disposed in the protective layer, and a connecting member disposed on the protective layer. The electronic unit includes a first electronic unit and a second electronic unit that are electrically connected through the connecting member. The at least one anchor structure is between the first electronic unit and the second electronic unit. The connecting member has a first conductive layer, and the first conductive layer contacts the surface of the first electronic unit, the surface of the anchor structure and the surface of the protective layer.