公开(公告)号：US20170146793A1

公开(公告)日：2017-05-25

申请号：US15355461

申请日：2016-11-18

Applicant: Innovative Micro Technology

Inventor： Christopher S. GUDEMAN ,  Sangwoo Kim ,  Stuart Hutchinson ,  Marin SIGURDSON

IPC: G02B26/08 ,  G03F7/26 ,  G02B1/11 ,  G03F7/20 ,  B81B3/00 ,  B81C1/00

CPC classification number: G03F7/26 ,  B81B7/0067 ,  B81B2201/042 ,  B81B2201/047 ,  B81C2203/0109 ,  G02B1/11 ,  G02B27/0983 ,  G03F7/2004 ,  G03F7/2008 ,  G03F7/201

Abstract: A microfabricated optical apparatus that includes a light source or light detector in combination with an integrated turning surface to form a microfabricated optical subassembly. The integrated turning surface may be formed directly in the substrate material using gray scale lithography.

公开(公告)号：US20170217767A1

公开(公告)日：2017-08-03

申请号：US15415919

申请日：2017-01-26

Applicant: Innovative Micro Technology

Inventor： Christopher S. GUDEMAN ,  Stuart Hutchinson

IPC: B81C1/00

CPC classification number: B81C1/00301 ,  B81C1/00095

Abstract: A through substrate via is formed by disposing a quantity of solder material at the top of a through hole formed in a substrate, coating the hole with a wetting layer, and melting the solder material such that it flows into the hole. The solder material may alloy with the wetting layer, freezing upon formation of the alloy. Subsequent processing steps may be performed at temperatures higher than the melting point of the solder material.