公开(公告)号：US20220117122A1

公开(公告)日：2022-04-14

申请号：US17555344

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Ali KALANTARIAN ,  Malcolm GUTENBURG ,  Andrew RANDELL ,  Mirui WANG ,  Tejas SHAH ,  Tamara J. LOW FOON ,  Jason LEE PACK ,  Yvan LARGE ,  Shahin AMIRI ,  Saanjali MAHARAJ ,  Srinivasarao KONAKALLA ,  Feroze KHAN ,  Nagaraj K ,  Babu TRIPLICANE GOPIKRISHNAN ,  Yogesh CHANNAIAH

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package having a semiconductor chip therein. The semiconductor chip package to communicate a temperature of the semiconductor chip. The apparatus includes a heat sink that is thermally coupled to the semiconductor chip package. The heat sink has fins. The apparatus includes a fan. The apparatus includes a temperature sensing device. The temperature sensing device is to sense a temperature of an ambient before the ambient is warmed by the fins. A rotational speed of the fan is to be determined from the temperature of the semiconductor chip and the temperature of the ambient.