公开(公告)号：US20210235603A1

公开(公告)日：2021-07-29

申请号：US17186092

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Justin HUTTULA ,  Bala SUBRAMANYA ,  Juha PAAVOLA ,  Mark CARBONE ,  Todd SMITH ,  Kari MANSUKOSKI ,  Samarth ALVA ,  Satyajit Siddharay KAMAT ,  Nagaraj K

IPC: H05K9/00 ,  H05K7/20

Abstract: A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.

公开(公告)号：US20230016098A1

公开(公告)日：2023-01-19

申请号：US17957698

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Navneeth Jayaraj ,  Prabhakar Subrahmanyam ,  Nagaraj K ,  Gopinath K ,  Paniraj Gururaja ,  Mahammad Yaseen Mulla ,  Nitesh Gupta ,  Ying-Feng Pang

IPC: G06F1/20 ,  H05K7/20

Abstract: Example field replaceable fan assemblies for peripheral processing units and related systems and methods are disclosed. An example apparatus includes a temperature sensor; a fan having a base; at least one memory; machine readable instructions; and processor circuitry to execute operations corresponding to the machine readable instructions to determine a first temperature based on an output of the temperature sensor; and cause the base of the fan to move based on the first temperature.

公开(公告)号：US20230093095A1

公开(公告)日：2023-03-23

申请号：US18059534

申请日：2022-11-29

Applicant: Intel Corporation

Inventor： Samarth Alva ,  Nagaraj K ,  Deepak Sekar ,  Arnab Sen

IPC: F16B23/00 ,  H05K1/02

Abstract: Low-profile fasteners with springs that are either integrated with the fastener or are a physically separate component can provide a more evenly distributed load to a heat transfer device, such as a vapor chamber or a heat pipe. The low-profile fasteners do not increase the height of the base of a mobile computing device as the spring and the portion of the fastener that extends past the spring fit within a recess or cavity of the heat transfer device. The spring can be a diaphragm spring, a wave spring, or another suitable spring. The use of low-profile fasteners with springs to fasten a heat transfer device to a mainboard may allow for designs with a smaller mainboard area, which can leave room for a larger thermal management solution (which can increase cooling capacity) and allow for a greater thermal design power for the system.

公开(公告)号：US20220117122A1

公开(公告)日：2022-04-14

申请号：US17555344

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Ali KALANTARIAN ,  Malcolm GUTENBURG ,  Andrew RANDELL ,  Mirui WANG ,  Tejas SHAH ,  Tamara J. LOW FOON ,  Jason LEE PACK ,  Yvan LARGE ,  Shahin AMIRI ,  Saanjali MAHARAJ ,  Srinivasarao KONAKALLA ,  Feroze KHAN ,  Nagaraj K ,  Babu TRIPLICANE GOPIKRISHNAN ,  Yogesh CHANNAIAH

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package having a semiconductor chip therein. The semiconductor chip package to communicate a temperature of the semiconductor chip. The apparatus includes a heat sink that is thermally coupled to the semiconductor chip package. The heat sink has fins. The apparatus includes a fan. The apparatus includes a temperature sensing device. The temperature sensing device is to sense a temperature of an ambient before the ambient is warmed by the fins. A rotational speed of the fan is to be determined from the temperature of the semiconductor chip and the temperature of the ambient.