公开(公告)号：US20220117122A1

公开(公告)日：2022-04-14

申请号：US17555344

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Ali KALANTARIAN ,  Malcolm GUTENBURG ,  Andrew RANDELL ,  Mirui WANG ,  Tejas SHAH ,  Tamara J. LOW FOON ,  Jason LEE PACK ,  Yvan LARGE ,  Shahin AMIRI ,  Saanjali MAHARAJ ,  Srinivasarao KONAKALLA ,  Feroze KHAN ,  Nagaraj K ,  Babu TRIPLICANE GOPIKRISHNAN ,  Yogesh CHANNAIAH

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package having a semiconductor chip therein. The semiconductor chip package to communicate a temperature of the semiconductor chip. The apparatus includes a heat sink that is thermally coupled to the semiconductor chip package. The heat sink has fins. The apparatus includes a fan. The apparatus includes a temperature sensing device. The temperature sensing device is to sense a temperature of an ambient before the ambient is warmed by the fins. A rotational speed of the fan is to be determined from the temperature of the semiconductor chip and the temperature of the ambient.

公开(公告)号：US20230320036A1

公开(公告)日：2023-10-05

申请号：US17711007

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Shahin AMIRI ,  Mirui WANG ,  Saman NASIRAHMADI ,  Ali KALANTARIAN ,  Tejas SHAH

IPC: H05K7/20 ,  H05K1/02 ,  F16B5/02

CPC classification number: H05K7/2039 ,  H05K7/20136 ,  H05K1/0204 ,  F16B5/02

Abstract: An apparatus is described. The apparatus includes a bolt to be inserted through a first hole in a cooling mass, a second hole in a planar mechanical element and a third hole in an electronic circuit board when the first, second and third holes are aligned. The apparatus includes a first spring element to be coupled to the cooling mass and the bolt. The first spring element is to be deformed from its nominal shape when the bolt is fastened to the electronic circuit board to draw the base of the cooling mass toward the electronic circuit board. The second spring element is to be coupled to the planar mechanical element and the bolt. The second spring element is to be deformed from its nominal shape to draw the planar mechanical element toward the electronic circuit board.

公开(公告)号：US20220113773A1

公开(公告)日：2022-04-14

申请号：US17560630

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： Lunyu MA ,  Shahin AMIRI ,  Casey CARTE ,  Mirui WANG ,  Damion SEARLS ,  Tamara J. LOW FOON

IPC: G06F1/18 ,  G06F13/42

Abstract: An apparatus is described. The apparatus includes an add-in card having multiple semiconductor chip packages mounted to a printed circuit board of the add-in card. The add-in card includes separate dedicated heat sinks respectively coupled to the semiconductor chip packages with spring loaded fixturing elements, a heat pipe coupled to a plurality of the heat sinks.

公开(公告)号：US20220113774A1

公开(公告)日：2022-04-14

申请号：US17556703

申请日：2021-12-20

Applicant: Intel Corporation

Inventor： Shahin AMIRI ,  Mirui WANG ,  Evan PANG ,  Robert SCHUM ,  Shahed SAFAVI-BAYAT ,  Xuefeng MA ,  Jason LEE PACK ,  Yvan LARGE

IPC: G06F1/20 ,  G06F13/42

Abstract: An apparatus is described. The apparatus includes an add-in card having a power connector to receive power other than through the add-in card's host connector. The power connector fitted in a notch of a printed circuit board of the add-in card so that, when the printed circuit board is oriented to have an upper surface with semiconductor chips disposed thereon, an upper surface of the connector is above the upper surface of the printed circuit board and a lower surface of the connector is below a lower surface of the printed circuit board.