公开(公告)号：US20230320036A1

公开(公告)日：2023-10-05

申请号：US17711007

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Shahin AMIRI ,  Mirui WANG ,  Saman NASIRAHMADI ,  Ali KALANTARIAN ,  Tejas SHAH

IPC: H05K7/20 ,  H05K1/02 ,  F16B5/02

CPC classification number: H05K7/2039 ,  H05K7/20136 ,  H05K1/0204 ,  F16B5/02

Abstract: An apparatus is described. The apparatus includes a bolt to be inserted through a first hole in a cooling mass, a second hole in a planar mechanical element and a third hole in an electronic circuit board when the first, second and third holes are aligned. The apparatus includes a first spring element to be coupled to the cooling mass and the bolt. The first spring element is to be deformed from its nominal shape when the bolt is fastened to the electronic circuit board to draw the base of the cooling mass toward the electronic circuit board. The second spring element is to be coupled to the planar mechanical element and the bolt. The second spring element is to be deformed from its nominal shape to draw the planar mechanical element toward the electronic circuit board.

公开(公告)号：US20230320010A1

公开(公告)日：2023-10-05

申请号：US17711018

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Jyotiba SURYAWANSHI ,  John MATHEW ,  Anudeep GALI ,  Jain Raj VETTUVAZHY PUTHENPURAYIL ,  Ali KALANTARIAN

IPC: H05K5/02 ,  H05K5/03 ,  H05K7/20

CPC classification number: H05K5/0269 ,  H05K5/03 ,  H05K5/0213 ,  H05K7/20172 ,  H05K7/20154

Abstract: An apparatus is described. The apparatus includes a multi-slot add-in card having a second air mover stacked with a first air mover. The add-in card has a heat sink. The heat sink has fins. The fins extend into a first path of a first air flow and a second path of a second air flow. The first air mover is to generate the first air flow and the second air mover is to generate the second air flow.

公开(公告)号：US20220117122A1

公开(公告)日：2022-04-14

申请号：US17555344

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Ali KALANTARIAN ,  Malcolm GUTENBURG ,  Andrew RANDELL ,  Mirui WANG ,  Tejas SHAH ,  Tamara J. LOW FOON ,  Jason LEE PACK ,  Yvan LARGE ,  Shahin AMIRI ,  Saanjali MAHARAJ ,  Srinivasarao KONAKALLA ,  Feroze KHAN ,  Nagaraj K ,  Babu TRIPLICANE GOPIKRISHNAN ,  Yogesh CHANNAIAH

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package having a semiconductor chip therein. The semiconductor chip package to communicate a temperature of the semiconductor chip. The apparatus includes a heat sink that is thermally coupled to the semiconductor chip package. The heat sink has fins. The apparatus includes a fan. The apparatus includes a temperature sensing device. The temperature sensing device is to sense a temperature of an ambient before the ambient is warmed by the fins. A rotational speed of the fan is to be determined from the temperature of the semiconductor chip and the temperature of the ambient.