MULTI-TILE GRAPHICS PROCESSING UNIT

    公开(公告)号:US20230051227A1

    公开(公告)日:2023-02-16

    申请号:US17978426

    申请日:2022-11-01

    申请人: Intel Corporation

    IPC分类号: G06T1/60 G06T1/20 G06F3/06

    摘要: An apparatus to facilitate processing in a multi-tile device is disclosed. In one embodiment, the apparatus includes a graphics processor comprising a first semiconductor die including a first high-bandwidth memory (HBM) device, a second semiconductor die including a second HBM device, and a third semiconductor die coupled with the first semiconductor die and the second semiconductor die in a 2.5-dimensional (2.5D) arrangement. The third semiconductor die includes a graphics processing resource and a cache coupled with the graphics processing resource. The cache is configurable to cache data associated with memory accessed by the graphics processing resource and the graphics processing resource includes a general-purpose graphics processor core and a tensor core.

    MULTI-TILE GRAPHICS PROCESSING UNIT

    公开(公告)号:US20220156879A1

    公开(公告)日:2022-05-19

    申请号:US16951217

    申请日:2020-11-18

    申请人: Intel Corporation

    IPC分类号: G06T1/60 G06T1/20 G06F3/06

    摘要: An apparatus to facilitate processing in a multi-tile device is disclosed. The apparatus comprises a plurality of processing tiles, each including a memory device and a plurality of processing resources, coupled to the device memory, and a memory management unit to manage the memory devices in each of the plurality of tiles to perform allocation of memory resources among the memory devices for execution by the plurality of processing resources.