公开(公告)号：US10297499B2

公开(公告)日：2019-05-21

申请号：US15642569

申请日：2017-07-06

Applicant: Intel Corporation

Inventor： Jeffrey S. Leib ,  Ralph T. Troeger ,  Daniel Bergstrom

IPC: H01L29/66 ,  H01L23/528 ,  H01L21/285 ,  H01L21/768 ,  H01L29/417 ,  H01L23/532 ,  H01L23/535 ,  H01L29/78

Abstract: Techniques and methods related to forming a wrap-around contact on a semiconductor device, and apparatus, system, and mobile platform incorporating such semiconductor devices.

公开(公告)号：US09704744B2

公开(公告)日：2017-07-11

申请号：US15026822

申请日：2013-12-19

Applicant: INTEL CORPORATION

Inventor： Jeffrey S Leib ,  Ralph T Troeger ,  Daniel Bergstrom

IPC: H01L21/768 ,  H01L29/417 ,  H01L29/66 ,  H01L21/285 ,  H01L23/528 ,  H01L23/532 ,  H01L23/535 ,  H01L29/78

CPC classification number: H01L21/76895 ,  H01L21/2855 ,  H01L21/28568 ,  H01L21/76865 ,  H01L21/76883 ,  H01L23/528 ,  H01L23/53266 ,  H01L23/535 ,  H01L29/41791 ,  H01L29/66795 ,  H01L29/785 ,  H01L2029/7858

Abstract: Techniques and methods related to forming a wrap-around contact on a semiconductor device, and apparatus, system, and mobile platform incorporating such semiconductor devices.

公开(公告)号：US20170309516A1

公开(公告)日：2017-10-26

申请号：US15642569

申请日：2017-07-06

Applicant: Intel Corporation

Inventor： Jeffrey S. Leib ,  Ralph T. Troeger ,  Daniel Bergstrom

IPC: H01L21/768 ,  H01L29/78 ,  H01L29/66 ,  H01L29/417 ,  H01L21/285 ,  H01L23/528 ,  H01L23/532 ,  H01L23/535

CPC classification number: H01L21/76895 ,  H01L21/2855 ,  H01L21/28568 ,  H01L21/76865 ,  H01L21/76883 ,  H01L23/528 ,  H01L23/53266 ,  H01L23/535 ,  H01L29/41791 ,  H01L29/66795 ,  H01L29/785 ,  H01L2029/7858

Abstract: Techniques and methods related to forming a wrap-around contact on a semiconductor device, and apparatus, system, and mobile platform incorporating such semiconductor devices.