公开(公告)号：US11211345B2

公开(公告)日：2021-12-28

申请号：US16604144

申请日：2017-06-19

申请人： Intel Corporation

发明人： Aleksandar Aleksov ,  Telesphor Kamgaing ,  Sri Ranga Sai Boyapati ,  Kristof Darmawikarta ,  Eyal Fayneh ,  Ofir Degani ,  David Levy ,  Johanna M. Swan

IPC分类号： H01L23/66 ,  H01L21/48 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

摘要： In-package radio frequency (RF) waveguides as high bandwidth chip-to-chip interconnects and methods for using the same are disclosed. In one example, an electronic package includes a package substrate, first and second silicon dies or tiles, and an RF waveguide. The first and second silicon dies or tiles are attached to the package substrate. The RF waveguide is formed in the package substrate and interconnects the first silicon die or tile with the second silicon die or tile.

公开(公告)号：US11894324B2

公开(公告)日：2024-02-06

申请号：US17528049

申请日：2021-11-16

申请人： Intel Corporation

发明人： Aleksandar Aleksov ,  Telesphor Kamgaing ,  Sri Ranga Sai Boyapati ,  Kristof Darmawikarta ,  Eyal Fayneh ,  Ofir Degani ,  David Levy ,  Johanna M. Swan

IPC分类号： H01L23/66 ,  H01L21/48 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L23/66 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L24/17 ,  H01L2223/6627 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2924/19033

摘要： In-package radio frequency (RF) waveguides as high bandwidth chip-to-chip interconnects and methods for using the same are disclosed. In one example, an electronic package includes a package substrate, first and second silicon dies or tiles, and an RF waveguide. The first and second silicon dies or tiles are attached to the package substrate. The RF waveguide is formed in the package substrate and interconnects the first silicon die or tile with the second silicon die or tile.