公开(公告)号：US09318850B2

公开(公告)日：2016-04-19

申请号：US14286494

申请日：2014-05-23

Applicant: Intel Corporation

Inventor： Xiang Li ,  Hao-Han Hsu ,  Yun Ling ,  Gong Ouyang ,  Kai Xiao ,  Jiangqi He ,  Lu-Vong T. Phan ,  Wei Xu

IPC: H01R12/00 ,  H01R13/6598 ,  H01R12/72 ,  H05K3/28 ,  H05K3/36 ,  H01R43/18

CPC classification number: H01R13/6598 ,  H01R12/712 ,  H01R12/721 ,  H01R12/724 ,  H01R13/658 ,  H01R43/18 ,  H05K3/284 ,  H05K3/36 ,  Y10T29/49128

Abstract: In an embodiment, a connector such as an edge connector includes a connector housing, a first set of pins configured within the housing and having first ends to couple to corresponding signal lines of a first circuit board and second ends to couple to corresponding signal lines of a mating connector of a second circuit board, and a conductive material adapted to the housing to reduce interference caused by one or more sources of interference. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，诸如边缘连接器的连接器包括连接器壳体，构造在壳体内的第一组引脚，并且具有耦合到第一电路板的相应信号线的第一端和第二端耦合到相应的信号线 第二电路板的配合连接器以及适于壳体的导电材料，以减少由一个或多个干扰源造成的干扰。 描述和要求保护其他实施例。

公开(公告)号：US10318396B2

公开(公告)日：2019-06-11

申请号：US14866884

申请日：2015-09-26

Applicant: Intel Corporation

Inventor： Jiangqi He ,  Hongfei Yan ,  Chunlei Guo ,  Wei Shen

IPC: G01K7/36 ,  G01K11/26 ,  G06F11/30

Abstract: A method and device for temperature measurement of a processor is disclosed. A temperature-sensing circuit of the processor may have an associated resonance frequency, wherein the resonance frequency depends on a temperature of the temperature-sensing circuit. A temperature of the temperature-sensing circuit may be determined by determining the resonance frequency of the temperature-sensing circuit.