公开(公告)号：US11133256B2

公开(公告)日：2021-09-28

申请号：US16446920

申请日：2019-06-20

Applicant: Intel Corporation

Inventor： Amit Kumar Jain ,  Sameer Shekhar ,  Chin Lee Kuan ,  Kevin Joseph Doran ,  Dong-Ho Han

IPC: H01L23/538 ,  H01L49/02 ,  H01L23/00

Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate; a bridge, embedded in the package substrate, wherein the bridge includes an integral passive component, and wherein a surface of the bridge include first contacts in a first interconnect area and second contacts in a second interconnect area; a first die coupled to the passive component via the first contacts in the first interconnect area; and a second die coupled to the second contacts in the second interconnect area.

公开(公告)号：US20210335712A1

公开(公告)日：2021-10-28

申请号：US17371293

申请日：2021-07-09

Applicant: Intel Corporation

Inventor： Amit Kumar Jain ,  Sameer Shekhar ,  Chin Lee Kuan ,  Kevin Joseph Doran ,  Dong-Ho Han

IPC: H01L23/538 ,  H01L49/02 ,  H01L23/00

Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate; a bridge, embedded in the package substrate, wherein the bridge includes an integral passive component, and wherein a surface of the bridge include first contacts in a first interconnect area and second contacts in a second interconnect area; a first die coupled to the passive component via the first contacts in the first interconnect area; and a second die coupled to the second contacts in the second interconnect area.

公开(公告)号：US11749606B2

公开(公告)日：2023-09-05

申请号：US17371293

申请日：2021-07-09

Applicant: Intel Corporation

Inventor： Amit Kumar Jain ,  Sameer Shekhar ,  Chin Lee Kuan ,  Kevin Joseph Doran ,  Dong-Ho Han

IPC: H01L23/538 ,  H01L49/02 ,  H01L23/00

CPC classification number: H01L23/5381 ,  H01L23/5383 ,  H01L28/20 ,  H01L28/40 ,  H01L23/5384 ,  H01L24/16 ,  H01L2224/16225

Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate; a bridge, embedded in the package substrate, wherein the bridge includes an integral passive component, and wherein a surface of the bridge include first contacts in a first interconnect area and second contacts in a second interconnect area; a first die coupled to the passive component via the first contacts in the first interconnect area; and a second die coupled to the second contacts in the second interconnect area.

公开(公告)号：US20190304915A1

公开(公告)日：2019-10-03

申请号：US16446920

申请日：2019-06-20

Applicant: Intel Corporation

Inventor： Amit Kumar Jain ,  Sameer Shekhar ,  Chin Lee Kuan ,  Kevin Joseph Doran ,  Dong-Ho Han

IPC: H01L23/538 ,  H01L49/02

Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate; a bridge, embedded in the package substrate, wherein the bridge includes an integral passive component, and wherein a surface of the bridge include first contacts in a first interconnect area and second contacts in a second interconnect area; a first die coupled to the passive component via the first contacts in the first interconnect area; and a second die coupled to the second contacts in the second interconnect area.