公开(公告)号：US20240241554A1

公开(公告)日：2024-07-18

申请号：US18285210

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Xiyong Tian ,  Chunlin Bai ,  Baoci George Sun ,  Li Zhang ,  Chiu Lun Ronald Cheng

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/206 ,  H05K7/20145

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first heat source, a second heat source, and a fan inside a fan enclosure between the first heat source and the second heat source. The fan enclosure includes a main vent to direct air from the fan towards a heatsink and one or more side vents to direct air from the fan towards the first heat source or the second heat source.