公开(公告)号：US20240241554A1

公开(公告)日：2024-07-18

申请号：US18285210

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Xiyong Tian ,  Chunlin Bai ,  Baoci George Sun ,  Li Zhang ,  Chiu Lun Ronald Cheng

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/206 ,  H05K7/20145

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first heat source, a second heat source, and a fan inside a fan enclosure between the first heat source and the second heat source. The fan enclosure includes a main vent to direct air from the fan towards a heatsink and one or more side vents to direct air from the fan towards the first heat source or the second heat source.

公开(公告)号：US12284793B2

公开(公告)日：2025-04-22

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu Bawa ,  Ruander Cardenas ,  Kathiravan D ,  Jia Yan Go ,  Chin Kung Goh ,  Jeff Ku ,  Prakash Kurma Raju ,  Baomin Liu ,  Twan Sing Loo ,  Mikko Makinen ,  Columbia Mishra ,  Juha Paavola ,  Prasanna Pichumani ,  Daniel Ragland ,  Kannan Raja ,  Khal Ern See ,  Javed Shaikh ,  Gokul Subramaniam ,  George Baoci Sun ,  Xiyong Tian ,  Hua Yang ,  Mark Carbone ,  Vivek Paranjape ,  Nehakausar Pinjari ,  Hari Shanker Thakur ,  Christopher Moore ,  Gustavo Fricke ,  Justin Huttula ,  Gavin Sung ,  Sammi Wy Liu ,  Arnab Sen ,  Chun-Ting Liu ,  Jason Y. Jiang ,  Gerry Juan ,  Shih Wei Nien ,  Lance Lin ,  Evan Kuklinski

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/34

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US20230127021A1

公开(公告)日：2023-04-27

申请号：US18146311

申请日：2022-12-23

Applicant: Intel Corporation

Inventor： Chunlin Bai ,  Xiyong Tian ,  Baoci Sun

IPC: H05K7/20 ,  G06F1/20

Abstract: Techniques for fan mechanisms with adjustable side vents are disclosed. In one embodiment, a fan housing has several side vents that can direct airflow to components around the fan housing. Vent covers can block the vents, directing the airflow to the primary vent and the heatsink for the processor and other components. When the speed of a fan in the fan housing is increased, the vent covers open, directing airflow to components around the fan housing. In another embodiment, several vent channels are defined in the vent housing. A motor connected to a vent barrier can move the vent barrier to block or unblock the vent channels, allowing for control of airflow. In another embodiment, a fan channel module with one or more vent channels can be attached to the fan housing, allowing for a flexible array of airflow patterns for the same fan housing.