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公开(公告)号:US10892406B2
公开(公告)日:2021-01-12
申请号:US15997628
申请日:2018-06-04
Applicant: Intel Corporation
Inventor: Stephen Russell , Andrea Gotti , Andrea Redaelli , Enrico Varesi , Innocenzo Tortorelli , Lorenzo Fratin , Alessandro Sebastiani
Abstract: A phase change memory (PCM) cell can include a PCM layer. A first electrode and a second electrode disposed on opposite sides of the PCM layer. The first electrode, the second electrode, or both includes a metal ceramic composite material layer disposed between an upper barrier layer and a lower barrier layer and wherein the metal ceramic composite material layer provides a corresponding electrode with an electrical resistivity of from 10 mOhm-cm to 1000 mOhm-cm.
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公开(公告)号:US20190044063A1
公开(公告)日:2019-02-07
申请号:US15942281
申请日:2018-03-30
Applicant: Intel Corporation
Inventor: Lorenzo Fratin , Russell L. Meyer , Fabio Pellizzer
IPC: H01L45/00
Abstract: A memory cell can include a chalcogenide material having a narrowed end. A conductive material can be positioned at the narrowed end of the chalcogenide material. A dielectric barrier layer can be disposed between the conductive material and the narrowed end of the chalcogenide material. A dielectric spacer material can be positioned along a narrowed segment of the chalcogenide material.
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公开(公告)号:US20190044060A1
公开(公告)日:2019-02-07
申请号:US15997628
申请日:2018-06-04
Applicant: Intel Corporation
Inventor: Stephen W. Russell , Andrea Gotti , Andrea Redaelli , Enrico Varesi , Innocenzo Tortorelli , Lorenzo Fratin , Alessandro Sebastiani
Abstract: A phase change memory (PCM) cell can include a PCM layer. A first electrode and a second electrode disposed on opposite sides of the PCM layer. The first electrode, the second electrode, or both includes a metal ceramic composite material layer disposed between an upper barrier layer and a lower barrier layer and wherein the metal ceramic composite material layer provides a corresponding electrode with an electrical resistivity of from 10 mOhm-cm to 1000 mOhm-cm.
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