公开(公告)号：US20160378145A1

公开(公告)日：2016-12-29

申请号：US14752920

申请日：2015-06-27

Applicant: INTEL CORPORATION

Inventor： Pei-yang Sung ,  Jeff Ku ,  Ming-Che Lee ,  Simon Tsai

IPC: G06F1/16 ,  E05F1/12

CPC classification number: G06F1/1681 ,  E05F1/1215 ,  E05Y2900/606 ,  G06F1/1626

Abstract: Particular embodiments described herein provide for device that includes a first housing, a cradle, and a hinge that rotatable couples the first housing to the cradle. The hinge includes a switch bolt configured to selectively provide friction torque to the hinge, a torsion spring configured to provide spring torque to the hinge, and a switch mechanism to activate and deactivate the switch bolt, wherein the friction torque provided by the switch bolt is greater than the spring torque provided by the torsion spring.

Abstract translation: 本文描述的特定实施例提供了包括第一壳体，支架和铰链的装置，其可旋转地将第一壳体耦合到支架。 铰链包括：开关螺栓，其构造成选择性地向铰链提供摩擦转矩;扭簧，其构造成向铰链提供弹簧扭矩;以及开关机构，用于启动和停用开关螺栓，其中由开关螺栓提供的摩擦转矩是 大于由扭转弹簧提供的弹簧扭矩。

公开(公告)号：USD798304S1

公开(公告)日：2017-09-26

申请号：US29540604

申请日：2015-09-25

Applicant: Intel Corporation

Designer： Pei-yang Sung ,  Jeff Ku ,  Ming-Che Lee ,  Oliver Tsui ,  Tim Liu

公开(公告)号：US20200337179A1

公开(公告)日：2020-10-22

申请号：US16914096

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Ming-Che Lee ,  Wei-Ming Chu ,  Cora Nien

IPC: H05K7/20

Abstract: Particular embodiments described herein provide for an expandable heat sink for an electronic device. The expandable heat sink includes flexible thermal conductive material and an activator. The activator can cause the expandable heat sink to be in a retracted configuration with a retracted height or in an expanded configuration with an expanded height, wherein the expanded height is greater than the retracted height. In an example, the flexible thermal conductive material includes graphite sheets.

公开(公告)号：US20170090516A1

公开(公告)日：2017-03-30

申请号：US14866742

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Pei-yang Sung ,  Ming-Che Lee ,  Oliver Tsui ,  Simon Tsai

IPC: G06F1/16 ,  H02J7/00

CPC classification number: G06F1/1632 ,  G06F1/1635 ,  G06F1/1669 ,  G06F1/1671 ,  G06F1/1681 ,  G06F1/1696 ,  H02J7/0042

Abstract: Particular embodiments described herein provide for an electronic device, that includes a main body, an interconnect attached to the main body, where the interconnect can electrically couple with different sized first housings, a hinge attached to the interconnect, where the hinge can rotatably couple the interconnect with the main body, and a porch, where the porch can accommodate different sized second housings.

公开(公告)号：US09557778B2

公开(公告)日：2017-01-31

申请号：US14752920

申请日：2015-06-27

Applicant: Intel Corporation

Inventor： Pei-Yang Sung ,  Jeff Ku ,  Ming-Che Lee ,  Simon Tsai

IPC: G06F1/16 ,  E05F1/12

CPC classification number: G06F1/1681 ,  E05F1/1215 ,  E05Y2900/606 ,  G06F1/1626

Abstract: Particular embodiments described herein provide for device that includes a first housing, a cradle, and a hinge that rotatable couples the first housing to the cradle. The hinge includes a switch bolt configured to selectively provide friction torque to the hinge, a torsion spring configured to provide spring torque to the hinge, and a switch mechanism to activate and deactivate the switch bolt, wherein the friction torque provided by the switch bolt is greater than the spring torque provided by the torsion spring.

Abstract translation: 本文描述的特定实施例提供了包括第一壳体，支架和铰链的装置，其可旋转地将第一壳体耦合到支架。 铰链包括：开关螺栓，其构造成选择性地向铰链提供摩擦转矩;扭簧，其构造成向铰链提供弹簧扭矩;以及开关机构，用于启动和停用开关螺栓，其中由开关螺栓提供的摩擦转矩是 大于由扭转弹簧提供的弹簧扭矩。