EXPANDABLE HEAT SINK
    1.
    发明申请

    公开(公告)号:US20200337179A1

    公开(公告)日:2020-10-22

    申请号:US16914096

    申请日:2020-06-26

    Abstract: Particular embodiments described herein provide for an expandable heat sink for an electronic device. The expandable heat sink includes flexible thermal conductive material and an activator. The activator can cause the expandable heat sink to be in a retracted configuration with a retracted height or in an expanded configuration with an expanded height, wherein the expanded height is greater than the retracted height. In an example, the flexible thermal conductive material includes graphite sheets.

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